MKS Sees Strong Sales for its Latest Flexible PCB Laser Processing Solution
December 2, 2020 | MKS Instruments, Inc.Estimated reading time: 1 minute

MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, announced that a leading PCB manufacturing customer in the Greater China region has purchased 80 units of the company’s ESI CapStone system for near-term delivery. CapStone is MKS’ latest flexible PCB laser processing system. It leverages the latest high-power, high-repetition rate laser technology and new beam control capabilities to deliver higher production throughput and higher yields.
“CapStone has definitely been a game changer,” said John Williams, Vice President and General Manager of MKS’ Equipment and Solutions division. “As Flex PCB manufacturers continue to upgrade their processing capabilities to address new technologies such as 5G, the CapStone system is enabling them to take advantage of latest-generation laser technology to stay current in a very competitive market.”
CapStone’s high-speed laser technology and unique beam positioning combine to allow manufacturers to meet the challenges associated with processing an increasingly-diverse set of flex PCBs at high yields, including 5G antennas and feedlines, wireless charging circuits, displays, cameras, and many other flex applications. With its significant throughput gains, process flexibility, and proven robust deployment even at large scale, CapStone reduces factory footprint and time to market for flex manufacturers to achieve the production capacity necessary to meet their accelerating flex demand.
About MKS Instruments
MKS Instruments, Inc. is a global provider of instruments, systems, subsystems and process control solutions that measure, monitor, deliver, analyze, power and control critical parameters of advanced manufacturing processes to improve process performance and productivity for our customers. Our products are derived from our core competencies in pressure measurement and control, flow measurement and control, gas and vapor delivery, gas composition analysis, electronic control technology, reactive gas generation and delivery, power generation and delivery, vacuum technology, lasers, photonics, optics, precision motion control, vibration control and laser-based manufacturing systems solutions. We also provide services relating to the maintenance and repair of our products, installation services and training. Our primary served markets include semiconductor, industrial technologies, life and health sciences, research and defense. Additional information can be found at www.mksinst.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.