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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 25, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
We started this week with the solstice. Here in the Northern Hemisphere, it’s the winter solstice; south of the equator, of course, it’s the summer solstice. Not only is this a big event on the astronomical calendar, solstice is a busy time for holy days worldwide. Whichever holiday schedule you follow, we wish that yours is festive, restorative, and full of hopefulness.
All that holiday revelry can certainly distract one’s attention; as evidenced in a much slower news week. As a result, this week’s Top 5 brings you the three most important and/or intriguing pieces of news we’ve covered in the last week, and two items from last week that are still drawing reader attention this week. That’s I-Connect007: Keeping you informed, efficiently.
Enjoy your holiday and Happy New Year!
Prices of Copper-Clad Laminates Continue to Rise
December 18
Recently, two major explosions at epoxy resin plants in China had a great impact on domestic resin suppliers, interrupting the supply of resin and caused prices to increase dramatically. I-Connect007 reports on the market dynamics and effects.
The press release states, “Industry experts believe a five-year, $40 million investment in a public-private R&D program would yield more than $100 million in U.S. defense savings per year and improve military readiness and overall innovation. The Congress provided $5 million for such R&D in FY 2020.”
For more detail, find IPC President and CEO John Mitchell’s article in Defense News titled, “Protecting America’s military prowess requires an embrace of lead-free electronics.”
COMSovereign Delivers First Tethered Drone-Based LTE Network
December 21
Emergency and disaster response teams are a great example for this new LTE mobile network system. Imagine a wildfire command post setting up on a remote hilltop and launching a series of hovering drones to serve as temporary cell towers in an area otherwise outside cell service.
Dr. John Mitchell on IPC APEX EXPO Going Virtual
December 16
In this audio interview, Barry Matties and Dr. John Mitchell discuss IPC’s decision to move IPC APEX EXPO 2021 to an all virtual platform. Mitchell explains the reasoning for going virtual, and expresses his enthusiasm for the opportunities this presents the conference. I-Connect007 will be providing preshow and realtime coverage of IPC APEX EXPO, so check with us often to get the latest.
Happy Holden: ECWC15 Virtual Event a Success
December 15
Few industry experts are as capable as Happy Holden to review the Electronic Circuits World Convention, held recently in Hong Kong. In this report, Happy summarizes the keynotes from the first day of the three-day event. Keynote speakers include: NT Information Ltd’s Dr. Hayoo Nakahara; James Tam, from Bosch; and Happy Holden himself.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.