Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
The Marketing Minute: Marketing With Layers
Post-Show Interview with IPC President John Mitchell
March 15, 2021 | Real Time with...IPCEstimated reading time: Less than a minute
In this relaxed wrap-up interview, John Mitchell shares his thoughts on this year’s virtual show with Barry Matties. Some of the emerging themes that came up include smart factory implementation and the increased traction for the emerging engineer program.
We invite you to visit Real Time with...IPC APEX EXPO 2021 for all the interviews produced by I-Connect007 in partnership with the IPC. Video and audio content is available now at realtimewith.com.
Later this month, watch for Real Time with...IPC APEX EXPO 2021 Show & Tell 2021, our celebrated special annual post-show magazine. We compile and highlight all of our show-related content and deliver it to current my I-Connect007 registrants.
To watch this Real Time with... IPC APEX EXPO interview, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.