-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Aegis’ Michael Ford Receives Dieter Bergman IPC Fellowship Award
April 9, 2021 | Business WireEstimated reading time: 2 minutes
Aegis Software, a global provider of IIoT-based Manufacturing Execution Software (MES), announces that Michael Ford, Senior Director Emerging Industry Strategy, based in the UK, has been awarded the Dieter Bergman IPC Fellowship Award in recognition of significant contribution to IPC standards development, and commitment to global standardization efforts across the industry.
“Working with fellow volunteers in the various IPC task groups, I have learned the importance of IPC standards to the well-being of the industry, as we create and realize the 'Factory of the Future' vision. The teamwork that IPC staff inspires between peers drives genuine cross-functional innovation,” states Michael Ford. “I feel honored to be recognized for my contribution, with achievements that have been gained so far, which include the IPC-2591 Connected Factory Exchange (CFX) standard, the IPC-1782 traceability and secure supply-chain standard, as well as the IPC-2551 Digital Twin standard, being achieved only as a result of contributions from so many members in each committee. I am very proud to be working with such talented people.”
Aegis Software has been active in many facets of IPC activities over many years, showing by example how IPC standards bring interoperability and fairness of opportunity to drive benefits for the industry as a whole, including machine vendors, solution providers such as Aegis, and not least, manufacturers themselves.
Jason Spera, CEO of Aegis Software, states, “We are proud of the achievements that Michael’s work with the IPC standards committees has helped make possible. The work of standardization is more important than ever before now that digitization is such a focus of manufacturers worldwide. Proprietary or highly customized technical approaches to solving problems are no longer workable. As we develop and introduce innovative new technologies into the complex manufacturing arena, manufacturers demand the assurance that tools offer plug-and-play interoperability, which is best supported by the timely creation and adoption of genuine consensus-based standards. Michael’s ability to foster collaboration and drive productivity among all committee members is a great accomplishment and key to getting standards published and adopted. We at Aegis are elated the IPC has recognized Michael’s work in this way, and that he chose Villanova University as the recipient of the grant.”
As part of the recognition, a scholarship has been awarded to the engineering department of Villanova University, alma mater to the founders of Aegis, with the intent to benefit the promotion of opportunities for women in the industry.
Related Article:
Michael Ford: Dieter Bergman IPC Fellowship Award Recipient
Suggested Items
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.