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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
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LSI ADL Technology Leverages IPC Membership for Growth, Training, and Industry Leadership
May 28, 2025 | Michelle Te, IPC CommunityEstimated reading time: 1 minute
Whether attending the EMS Leadership Summit at IPC APEX EXPO, or subscribing to workforce training, LSI ADL Technology has noted several positive changes directly related to its IPC membership.
“Collaboration, brainstorming, and sharing best practices have been the most important aspects of our partnership with IPC,” says Jonathan Verity, assistant general manager at LSI ADL Technology. “IPC provides the knowledge, training, and tools that allow our business, operators, and staff to be the most successful they can be in managing our business and customer relationships.”
ADL Technology was established in 1993 in Columbus, Ohio, as an engineering design company. Four years later, it entered the contract manufacturing business, starting with PCB assemblies and expanding into box-build assembly in 2004.
ADL formed a key partnership with LSI Industries, producing all the LED assemblies for its lighting projects. As a result, LSI acquired ADL in 2009, adding more surface mount technology, expanding the capabilities of its production operations, and growing its business by investing in integrated manufacturing and design services.
“Our fantastic team has done exceptional work over the years to shape this business for growth,” Jonathan says. “Our current challenge is how we successfully gear this business for continued growth by making it highly efficient and scalable to meet our customers’ current and future needs.”
Continue reading this article in the Spring 2025 issue of IPC Community.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.