-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Enics Inaugurates First Manufacturing Site in Malaysia
April 21, 2021 | EnicsEstimated reading time: 1 minute
Enics celebrated the inauguration of its new manufacturing site in the virtual Enics EXCELeration event on April 20, 2021. The site located in Senai, Johor is Enics’ first manufacturing site in Malaysia and in South-East Asia.
The construction of Enics new manufacturing site in Malaysia took place during 2020, and was not slowed down by the COVID-19-related restrictions. The factory has already produced its first PCBAs and is ready to expand its production to full high-volume electronics manufacturing.
“Malaysia has long record for being an excellent host country for international investors and it’s one of the global hubs for Electronic Industry in South-East Asia with also global reach. We started our Malaysia project in March 2020, in the middle of the first wave of the pandemic. Due to circumstances over the course of last year we have built the factory fully remotely, still in very short time and without any compromises on workmanship and quality of execution. Clear vision and mission, solid knowledge about and experience with Malaysia as a place to invest, a professional partner working with us and the strong dedication and commitment of Enics teams have been the enabler of this achievement’’, tells Enics Chief Operations Officer Udo Streller.
“The Malaysia manufacturing site compliments Enics presence in Asia and gives us and our customers new opportunities in South-East Asia and even beyond. We count on Regionalization to secure the supply and assure quality of deliveries, being where our customers are. We offer to our customers supply chains which are agile and short, serving our regional set up for development and manufacturing.
The regional approach serves not only reliability of supply chains but also helps in reducing our carbon footprint. Our future is sustainable and smart”, comments Enics President and CEO Elke Eckstein.
The 10.000 sqm Enics Malaysia manufacturing site is located in iPark industrial park in Senai, Johor, adjacent to Johor Bahru and Singapore. The site offers high-volume electronics manufacturing, serving customers in the industrial electronics segment.
Suggested Items
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.