Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop

06/26/2025 | Indium
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A

ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging

05/15/2025 | BUSINESS WIRE
ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform.

SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics

05/01/2025 | SEMI
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.

Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025

04/30/2025 | SEMI
Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same quarter of 2024, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications

04/08/2025 | Ranovus
Cerebras Systems, the pioneer in accelerating generative AI, has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA), for the development of a state-of-the-art high-performance computing system. The Cerebras system will combine the power of Cerebras’ wafer scale technology and Ranovus’ wafer scale co-packaged optics to deliver several orders of magnitude better compute performance at a fraction of the power draw.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved. Log in