American Made Advocacy: A Growing Presence in Washington in Turbulent Times
It’s Only Common Sense: How to Win Back Lost Customers
Punching Out: M&A North American PCB and EMS Deals for the First Half of 2025
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
May 1, 2025 | SEMIEstimated reading time: 2 minutes
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden. The Summit will offer insights into the latest heterogeneous integration innovations that are strengthening Europe’s semiconductor resilience and powering the next generation of intelligent systems. Registration is open.
3d system summitThemed Heterogenous Integration: Bolstering Europe's Resilience, this year’s Summit will feature an expanded program covering geopolitical dynamics, market trends, chiplet design, as well as the latest advancements in chiplet applications and hybrid bonding techniques.
“We look forward to welcoming industry leaders, innovators, and researchers to showcase their latest technologies and developments at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “As Europe advances in chiplet architectures, hybrid bonding, and co-packaged optics, the Summit provides a unique platform to drive collaboration and highlight the innovations shaping the future of semiconductors.”
3D & Systems Summit Sessions
NextGen Talent: Empowering Careers, Driving Growth
Featuring insights from semiconductor leaders, educators, and students, this session will highlight best practices for attracting, developing, and retraining top talent. Experts will discuss strategies that foster innovation, bridge talent gap, and create meaningful career opportunities—key to securing Europe’s continued leadership in the semiconductor industry.
Session 1: Geopolitical Dynamics and Market Trends
Executive leaders will examine how geopolitical dynamics are reshaping the semiconductor industry, highlighting Europe’s strategic role amid global demand shifts and supply chain disruptions.
Session 2: Chiplet Applications: System Level Architectures
Industry experts will explore the diverse applications of chiplet technology in various fields, highlighting the conceptual aspects of design and 3D integration.
Session 3: Hybrid Bonding - Die to Wafer
Specialists will focus on die-to-wafer hybrid bonding and its role in enabling advanced 3D integration, with insights into scalability, cost-effectiveness, and the roadmap for industry adoption.
Session 4: Hybrid Bonding - Wafer to Wafer
Experts will discuss wafer-to-wafer hybrid bonding technologies and examine the current state of these technologies as well as the technical and market challenges they face.
Session 5: Photonics and Co-Package Optics
Industry leaders will share insights into the integration of photonics and co-package optics, and how these advancements can drive innovation and efficiency across diverse industries.
Session 6: European Readiness: Design, Materials, Manufacturing
Visionaries will explore the design, materials, and manufacturing scalability of technologies, highlighting key challenges, cost-effective factors, and innovative solutions for advancing 3D integrated circuits and chiplet production.
Global Leaders to Present
3D & Systems Summit presenters include experts from these global leaders:
- Adeia
- ASML
- Besi
- Bosch
- CEA-Leti
- Confovis
- ETEL S.A.
- European Semiconductor Manufacturing Company (ESMC)
- EV Group
- Fraunhofer
- imec
- Infinitesima
- Intel
- KLA
- Lam Research
- NXP Semiconductors
- RANOVUS
- SUSS MicroTec
- TechSearch International
- Yole Grou
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Beyond Recycling: Reshaping Sustainability in Electronics
07/24/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability, especially for carbon-intensive industries like electronics manufacturing, means businesses are often plagued with various reporting requirements that don’t necessarily address the root problem. To that end, SERI and the Global Electronics Association are teaming up to reshape sustainability in electronics.
AI-driven MES Rewriting the Rules of Manufacturing Transformation
07/23/2025 | Francisco Almada Lobo, Critical ManufacturingThe Critical Manufacturing MES & Industry 4.0 International Summit, June 12–13, revealed a profound shift in how manufacturers approach digital transformation. AI-enabled execution systems are no longer a future ambition but are essential for navigating complexity and driving change.
Summit Interconnect Participates in PCBAA Annual Meeting to Advance U.S. Electronics Policy
06/26/2025 | Summit Interconnect, Inc.Summit Interconnect was proud to participate in the 2025 Annual Meeting of the Printed Circuit Board Association of America (PCBAA), held in Washington, D.C. this June.
SEMICON Southeast Asia 2025 Mega Show Opens in Singapore with Top Global C-suite Executives at Inaugural CEO Summit
05/21/2025 | SEMISEMICON Southeast Asia (SEA) 2025, the region’s flagship global electronics manufacturing and semiconductor supply chain event, officially opened today at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore.
Join the Conversation: MESI 4.0 Summit 2025
05/15/2025 | Critical ManufacturingThe MES and Industry 4.0 International Summit 2025 (MESI 4.0 Summit), hosted by Critical Manufacturing, will bring together manufacturing leaders, technology experts, and industry pioneers in Porto on June 12-13, offering a unique platform to explore practical strategies for digital transformation and smart manufacturing.