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VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones

06/09/2025 | BUSINESS WIRE
VeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.

Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems

06/05/2025 | Cadence Design Systems, Inc.
Cadence announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive.

Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems

05/27/2025 | Imec
At the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.

2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue

04/29/2025 | SEMI
Global semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported in its Materials Market Data Subscription (MMDS).

Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs

04/24/2025 | Marcy LaRont, I-Connect007
At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.
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