Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
I-Connect007 Releases Segment 3 of Koh Young Webinar Series: 'Data Integrity'
October 6, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Watch and learn!
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity, and smart factory success.
Coming in at just over 5 minutes, the third episode, “Data Integrity,” is now available to view. As attendees will learn, 3D data is only valid when 3D technology is used for all component types to extract the exact body dimensions.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to...SMT Inspection, Today, Tomorrow and Beyond, throughout the series, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.
Visit Converting Process Data Into Intelligence and start watching, free, today!
Share on:
