-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Compal Announces Completion of New Automotive Electronics Facility in Poland, Signaling Strategic Growth in Europe
June 30, 2025 | Compal Electronics Inc.Estimated reading time: 1 minute
Compal Electronics is proud to announce the completion of Phase One of its new manufacturing facility in Czeladź, Silesian Voivodeship, Poland, marking a major milestone in its strategic expansion into the European automotive electronics market.
The new plant is dedicated to the production of automotive electronic parts (AEP), with a particular focus on electronic control units. In the future, the facility will expand its product portfolio to include advanced driver-assistance systems (ADAS) and autonomous driving system (ADS) sensors, reflecting Compal’s commitment to innovation and the evolving needs of the automotive industry.
Phase One of the facility was completed in June 2025, with trial production expected by the end of 2025 and mass production scheduled to begin in 2026. The plant is designed to support a maximum annual capacity of 3.5 million control units, operating seven fully automated assembly and testing lines in a cleanroom and positive pressure environment.
This facility underscores Compal’s dedication to serving European automotive OEMs and Tier-one suppliers locally, enhancing supply chain efficiency and responsiveness. “Our Poland facility represents a significant step forward in our global automotive strategy,” said Arthur Wang, Senior Vice President at Compal AEPBU. “It’s designed to meet the highest standards of quality, sustainability, and technological advancement.”
The facility is expected to achieve ISO 9001:2015 and IATF 16949 certifications, and has been designed to meet the BREEAM “Excellent” rating for sustainable building practices.
The Poland Plan was first announced during a groundbreaking ceremony in July 2024, marking the beginning of Compal’s journey to strengthen its presence in the European automotive electronics sector. A potential Phase Two expansion is under consideration, contingent on future developments in international trade and tariff policies. This strategic move also includes the establishment of a local business development and technical support team, enabling close collaboration with European customers on engineering and product development.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.