proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring
November 2, 2021 | PRNewswireEstimated reading time: 1 minute
proteanTecs, a leading provider of deep data solutions for advanced electronics, announced that it's Universal Chip Telemetry™ (UCT) monitoring technology now supports TSMC's advanced 3nm process.
The company joined the TSMC IP Alliance Program earlier this year, offering silicon-verified, production-proven solutions in TSMC process technologies down to 5nm. "This announcement marks yet another milestone achieved in our long-term collaboration with TSMC to bring scale and optimization to the industry, with visibility into the 3nm generation of silicon process nodes, from production to lifetime operation. Chip makers, system manufacturers, and service providers gain the assurance they need to bring robust and competitive products to market," commented Evelyn Landman, co-founder and CTO of proteanTecs.
proteanTecs has developed enterprise cloud and edge monitoring software based on deep data. The novel data is generated by on-chip UCT Agents™ (monitoring IPs) that are built for analytics. Customers gain actionable insights with automated feedback deployment, enabling them to maximize profit, ensure supply, and exceed operational growth.
During product bring-up and volume testing, chip and system vendors can optimize power-performance per application, improve performance robustness, optimize and track reliability margins, and significantly shorten time to market.
Once deployed in the field, service providers can be alerted on faults before failures, reduce maintenance costs and RMAs, optimize system performance, and extend product lifetime.
"We are pleased with the results of our long-term partnership with proteanTecs in next-generation design enablement," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "The availability of proteanTecs UCT on TSMC's 3nm technology will help our mutual customers achieve silicon innovations benefiting from the significant power and performance boost of our most advanced process technology and quickly launch their new product innovations to market."
Designed for analytics, proteanTecs' UCT Agents are widespread to provide extremely high coverage with negligible PPA (power, performance, area) impact, and operate in test and in mission modes. By extracting data from the Agents and analyzing it in the cloud-based platform using machine learning algorithms, users along the value chain gain:
- Performance and performance degradation monitoring
- Operational, application and environmental monitoring
- Precision profiling and classification
- Interconnect performance monitoring
proteanTecs provides a suite of automated UCT integration tools that perform design assessment, advising on strategic Agent placement for optimal coverage and fusion.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
AI Boom to Drive 24.8% Foundry Growth in 2026
03/19/2026 | TrendForceTrendForce’s latest research on the foundry industry reveals that continued investment in the AI arms race by North American CSPs and AI startups will keep demand for AI processors and supporting ICs strong in 2026.
Taiwan Pushes Back on U.S., Citing 40% Goal ‘Impossible’
02/10/2026 | I-Connect007Taiwan has pushed back strongly against U.S. calls to shift a large share of its semiconductor manufacturing capacity to American soil, saying such a move is unrealistic and would undermine an ecosystem built over decades, according to a recent Reuters news article.
Tesla Weighs Building ‘Gigantic’ Chip Fab to Meet AI Demand
11/17/2025 | I-Connect007 Editorial TeamTesla CEO Elon Musk said the company will probably need to build a “gigantic” semiconductor fabrication plant to support its expanding artificial intelligence and robotics plans, CNBC reported.
GlobalFoundries Adopts TSMC GaN Technology to Boost U.S. Power Chip Production
11/11/2025 | GlobalFoundriesGlobalFoundries (GF) announced that it has entered into a technology licensing agreement with TSMC for 650V and 80V Gallium Nitride (GaN) technology.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.