-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Amphenol Announces Acquisition of Halo Technology, Closing of Sale of MTS Test & Simulation Business
December 2, 2021 | Business WireEstimated reading time: 1 minute
Amphenol Corporation announced that it has acquired Halo Technology Limited for approximately $715 million.
Halo is headquartered in Tustin, California with operations in North America and Europe, and is a leading provider of active and passive fiber optic interconnect components for the communications infrastructure markets with expected 2021 sales of approximately $250 million.
“We are excited to welcome the entire Halo Technology team to the Amphenol family,” said R. Adam Norwitt, Amphenol’s President and CEO. “Halo’s product offerings are very complementary to our existing high-speed and fiber optic interconnect solutions and represent a significant long-term growth opportunity for Amphenol. In particular, Halo’s high-technology products strengthen our offering to IT and data communications, mobile networks and broadband customers, all of whom are upgrading their systems and networks to manage increased data traffic. We look forward to working closely with Halo’s experienced management team to deliver a broader range of interconnect solutions to our customers around the world.”
Consistent with the Company’s acquisition strategy, Amphenol expects the acquisition to be accretive to earnings per share in the first year post closing. Amphenol will provide further information on the acquisition on its next regularly scheduled earnings call.
Separately, Amphenol also announced the closing of the sale of the MTS Test & Simulation business to Illinois Tool Works Inc. (NYSE: ITW). Since the closing of the MTS Systems Corporation transaction earlier this year, Amphenol has reported the Test & Simulation business as a discontinued operation and therefore the closing of the sale will have no impact on Amphenol’s financial results from continuing operations or fourth quarter guidance.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Dubai Launches Global Blueprint for Artificial Intelligence
05/02/2024 | BUSINESS WIREDubai has launched a blueprint for Artificial Intelligence (AI), a yearly plan that will focus on harnessing the technology’s potential to improve quality of life around the world.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.