-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
North American PCB Industry Sales Up 5.4% in November
December 22, 2021 | IPCEstimated reading time: 1 minute
IPC announced the November 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.10.
Total North American PCB shipments in November 2021 were up 5.4 percent compared to the same month last year. Compared to the preceding month, November shipments fell 2.2 percent.
PCB year-to-date bookings in November were down 1.2 percent compared to last year. Bookings in November fell 10.2 percent from the previous month.
“Lower than normal utilization rates and other supply chain struggles continue to restrain PCB shipments,” said Shawn DuBravac, IPC’s chief economist. “Year-to-date books are up nearly 18% while shipments are up 5.7% over the same time period.”
Detailed Data Available
Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.
Interpreting the Data
The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.
IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.