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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Eltek Names Ron Freund as Chief Financial Officer
December 31, 2021 | PRNewswireEstimated reading time: 1 minute

Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that its Board of Directors has named Ron Freund as its Chief Financial Officer, effective January 1, 2022. Freund will succeed Mr. Alon Mualem, who resigned to pursue a business opportunity.
Prior to joining Eltek, Freund served as the CFO of Ophir Tours Ltd. from 2015 to 2021. From 2011 to 2014, Freund served as the CFO of Middle East Tube Company Ltd., an Israeli public company, traded on the Tel Aviv Stock Exchange (TASE). In previous roles, Freund served as Deputy CEO and CFO of Soltam Systems LTD. and as a Senior Partner at Ernst & Young Israel. Freund holds a B.A. degree in Accounting and Economics from the Hebrew University, Jerusalem, and is a licensed CPA (Israel).
Eli Yaffe, CEO, commented: "The entire management team at Eltek is excited to have Mr. Freund on board and we are confident that he will be an important factor in Eltek's growth and future success. I would also like to take this opportunity to thank Alon Mualem for his contribution to our company, mainly with respect to Eltek's successful turnaround that we implemented during the last 3 years and wish him all the best in his next endeavor."
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Brent Fischthal - Koh YoungSuggested Items
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia
07/30/2025 | TPCAAs the global supply chain continues to restructure, Southeast Asia, leveraging its geographical advantages and favorable policies, has become a strategic hub for global circuit board manufacturing.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.
From Attraction to Action: Where Marketing Ends and Sales Begins
07/29/2025 | Brittany Martin, I-Connect007Before a PO hits the system, marketing has already done a lot of heavy lifting. Without strategic marketing, the PO might never arrive. At I-Connect007, we have been fortunate to help many companies achieve sales success through marketing. The key to success? Understanding how marketing leads to sales.
Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability
07/25/2025 | Calumet ElectronicsCalumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.