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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 14, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
We’re driving headlong into 2022, and there’s a lot going on in the world of PCB design, fabrication, and assembly. It’s trade show season now. IPC APEX EXPO starts in less than two weeks, and we’re all getting ready for what is, for many, the first trade show in years. Do you know where you put your business cards after your last show in 2020? I keep half a box of biz cards in my glove compartment; I’m not going to make that mistake again.
Trade shows are well represented in this week’s Top Five, along with news about a new Isola eBook on advanced materials and an article on the Factory of the Future. I imagine you’ll find more information about high-performance materials and the Smart Factory at IPC APEX EXPO.
I hope to see you all in San Diego, but if you can’t make it, check in with I-Connect007 throughout the week for the latest show updates.
New Book From Isola Highlights Importance of Material Selection
Published January 13
The latest I-007eBook, The Printed Circuit Designer’s Guide to... High Performance Materials, authored by Isola’s Michael Gay, provides PCB designers and design engineers with guidelines for selecting the proper advanced material for each application. This free eBook can help you weave your way through the maze of available high-performance materials available now.
CES 2022: Half Virtual, Still Valuable, and Here’s Why
Published January 13
Consumer Editor Dan Feinberg has been covering the changing technology at CES for over a decade. But this year, Dan is covering the show virtually, and apparently, about half of the usual attendees also decided to log into the show instead of traveling to Las Vegas. Still, as Dan explains in this post-show review, there was plenty of innovation on display at this year’s CES.
AltiumLive 2022 CONNECT Announces European Summit Dates
Published January 13
Altium has announced the dates for its European AltiumLive event, February 2-4, 2022. Taking place one week after its U.S. counterpart, the European Summit will also be a virtual affair, with tracks including Design Principles and Practices; Simulation, Test & Measurement; Supply Chain; Manufacturing, and classes devoted to Altium tools. Registration for the European AltiumLive is open now.
Making the Most of a Smart Factory Initiative
Published January 11
In this conversation from the January issue of SMT007 Magazine, Editor Nolan Johnson speaks with Koh Young’s Joel Scutchfield about the company’s focus on the Smart Factory Initiative. They also discuss trends in the global market, including artificial intelligence, predictive maintenance, and data analytics.
Happy Holden’s Five Must-Reads of 2021
Published January 10
As we entered 2022, we asked Happy Holden to review the articles that we published last year and pick his Top Five. Always up for a challenge, Happy went through our 2021 offerings and named his five favorites, along with his criteria for selecting them. We hope you enjoy this insight into the kind of articles that Happy finds interesting.
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Sweeney Ng - CEE PCBSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.