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Day 3: Lots of Action in San Diego
January 27, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
The perfect San Diego weather on Wednesday morning ushered in another full day at IPC APEX EXPO 2022. IPC President and CEO John W. Mitchell’s keynote presentation offered a roadmap for the organization and the future of the electronics manufacturing industry. IPC runs on the contributions of its tireless volunteers, and a group of these engineers and technologists were honored at yesterday’s Awards Luncheon.
The traffic on the show floor was steady most of the day, and we saw a constant stream of visitors in the I-Connect007 booth and studio. Dozens of the industry’s top executives, experts, and engineers stopped by for video interviews. You can check out these interviews at our Real Time with… IPC APEX EXPO site.
Everyone we interviewed was happy to be back at a live trade show. Some people hadn't flown in for two years. It was nice to see Technology Editor Pete Starkey, who was able to travel here safely from the UK.
Be sure to follow our daily newsletter for news, and www.realtimewith.com for video interviews and photos from the show floor. After IPC APEX EXPO, keep an eye out for our special Show & Tell edition, with all the in-depth coverage of this week's events.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.