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Real Time with… IPC APEX EXPO 2024: Insight into STARTEAM Global

05/22/2024 | Real Time with...IPC APEX EXPO
In this interview, Martin Schneider, CTO of STARTEAM Global, talks about his long career journey that has given him valuable industry experience. He discusses his role as CTO, the company's initiatives in North America, the company's journey and its expansion into Thailand, as well as the advantages of attending IPC APEX EXPO. He expresses his gratitude and admiration for the industry.

The Data Brings Us Together

05/22/2024 | Nolan Johnson, I-Connect007
IPC APEX EXPO 2024 wrapped up after a week of immersion in printed circuits and electronics manufacturing, so why did I keep thinking about wood joinery as I flew home rather than fabrication and assembly?

Robotas Drives Industry 4.0 with IPC CFX Integration for Mascot Product Line

05/22/2024 | Robotas Technologies Ltd.
Robotas Technologies Ltd., pioneers and specialists in the world of THT component placement and clinching systems, has recently announced the adoption of the IPC Connected Factory Exchange (CFX) standard for their Mascot product family.

Advocacy: There’s No Time to Waste

05/21/2024 | Marcy LaRont, PCB007 Magazine
In the late 1990s, I worked for a PCB company ardently working to build manufacturing presences in Malaysia, Taiwan, and eventually China’s mainland. For some of us who had the resources, we followed our OEM customers offshore as they began demanding increasingly greater price concessions from their stateside suppliers. The government was not coming to the rescue of the PCB manufacturer, so we rode the changing economic tide as it turned unwaveringly toward globalism and cheaper labor.

Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC

05/21/2024 | Real Time with...IPC APEX EXPO
Devan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
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