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IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
May 21, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Devan Iyer, IPC's new chief strategist of advanced packaging, shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies across different markets. Devan is looking forward to collaborating with IPC and industry members as they find ways to connect emerging package technologies with PCB/EMS systems.
Click to watch the interview on our Real Time with... IPC APEX EXPO 2024 event site.
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Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley
04/17/2025 | PRNewswireLam Research Corp. announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.
Rocket Lab Onramped to Multi-Billion Dollar U.S. and U.K. Defense Contracts
04/15/2025 | BUSINESS WIRERocket Lab USA, Inc., a global leader in launch services and space systems, announced it has been selected to provide hypersonic test launch capability with its HASTE launch vehicle, engineering expertise, and other services through its participation in two multi-billion dollar government development programs for the United States and the United Kingdom.
STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint and Resize Global Cost Base
04/14/2025 | STMicroelectronicsSTMicroelectronics N.V., a global semiconductor leader serving customers across the spectrum of electronics applications, disclosed further elements of its program to reshape its global manufacturing footprint.
Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow
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