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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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IPC: Electronics Industry Commends U.S. House Action on America COMPETES Act
February 3, 2022 | IPCEstimated reading time: 1 minute
The electronics manufacturing industry is applauding a bill being voted on this week in the U.S. House of Representatives, which would, if enacted, launch a new era of federal government partnership with the industry.
IPC supports H.R. 4521, the America COMPETES Act and its objective of strengthening the United States’ technology capabilities.
Like its Senate counterpart, the U.S. Innovation and Competitiveness Act (USICA), the America COMPETES Act contains $52 billion to strengthen the U.S. semiconductor industry and implement the CHIPS for America Act. Also like the Senate bill, the House bill would boost federal investment in research and development (R&D) in a variety of technologies.
Notably, the House bill would appropriate at least $2.5 billion in fiscal 2023 for advanced packaging R&D, aimed at helping U.S.-based companies adopt new techniques to electronically connect multiple chips in a single package through integrated circuit substrates. In a post-Moore’s Law world, with the pace of improvements in chips slowing down, advanced packaging offers an alternative way to achieve more computing power and economic efficiency.
A report last week from the U.S. Commerce Department called for urgent action on semiconductors. But chips do not function on their own. Recent IPC studies have urged Congress to combine its investments in semiconductor manufacturing with additional support for advanced packaging, printed circuit boards (PCBs), and related technologies. Without such action, U.S.-made chips would still need to be sent offshore to be manufactured into finished products, leaving the U.S. vulnerable to supply chain shocks.
“We’re pleased to see Congress making progress on the bipartisan goal of re-establishing U.S. leadership in advanced electronics, which power everything from automobiles to medical devices, aircraft, smartphones, and beyond,” said IPC President and CEO John W. Mitchell. “This bill has the potential to begin rebuilding the U.S. electronics manufacturing ecosystem.”
Adds Chris Mitchell, IPC vice president of global government relations, “While the U.S. has allowed its domestic electronics industries to atrophy, America’s competitors have invested heavily in theirs. This legislation is an opportunity to put America on pace to rebuild this crucial industry, which is so vital to our future security and prosperity.”
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04/20/2026 | Real Time with... APEX EXPOThe first advanced electronics packaging conference was well received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year is the Design Pavilion and Technology Theater, bringing commercial value to technical discussions and highlighting the critical role of timely standards development in rapidly evolving sectors like AI and automotive.
Altus Sees Record Start to 2026 as UK And Ireland Electronics Sector Gains Momentum
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The Future of Reflow Soldering Is Here
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The Global Electronics Association Is Future Forward
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