Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
Real Time with… IPC APEX EXPO 2022: The Supply Chain and Markets
February 15, 2022 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Pete Starkey interviews Mark Goodwin, COO of Ventec International Group, on the impact of the current supply chain condition. Their conversation also covers aerospace and the U.S. market.
If you were unable to attend IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
Watch this interview below or click here to view on our show page.
Check out this additional content from Ventec International Group:
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The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh (a free eBook available for download)
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Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
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You can also view other titles in our full I-007e Book library here
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