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Suggested Items

Preventing Surface Prep Defects and Ensuring Reliability

06/10/2025 | Marcy LaRont, PCB007 Magazine
In printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.

RF PCB Design Tips and Tricks

05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+
There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.

Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper

05/09/2025 | Michael Carano -- Column: Trouble in Your Tank
In the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.

Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.

Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating

04/15/2025 | Michael Carano -- Column: Trouble in Your Tank
There are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
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