-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
iNEMI Announces Results of Board of Directors Election
April 7, 2022 | iNEMIEstimated reading time: 1 minute
Four directors have been re-elected to the iNEMI Board plus we have added a new Director. Help us welcome Dr. Andy Mackie (Indium Corporation) as our newest Board member and congratulate Mostafa Aghazadeh (Intel), Dr. Ravi Bhatkal (MacDermid Alpha Electronics Solutions), Ranjan Chatterjee (Cimetrix by PDF/SOLUTIONS) and Dr. Hannes Voraberger (AT&S) on their re-election.
New iNEMI Roadmap Will Launch with Three Pilot Topics
Following our recent roadmap webinar — “The iNEMI Roadmap Refresh: from Lord of the Rings to Wikipedia” — we are now launching the next phase of the new online iNEMI Roadmap. We are running pilots for three topics — 5G/6G materials and testing, smart manufacturing and flexible hybrid electronics — targeting online publication by mid-year. Interested in shaping industry consensus on these and other topics in electronics manufacturing? Please fill out our expression-of-interest form to get involved with the next iNEMI Roadmap. Contributing to the roadmap is a great opportunity to shape the future of technologies in electronics manufacturing with the needs of the industry in mind, and participation provides a powerful means to validate your organization’s understanding of the critical application drivers and technology challenges.
We Need Your Input on Smart Manufacturing Maturity in Your Organization
The iNEMI Smart Manufacturing Technology Integration Group (TIG) is surveying our members and the electronics industry at large to help define and develop future iNEMI collaborations in smart manufacturing. Input from this survey will help us identify common areas of need where it makes sense for industry to work together to enable deployment of smart manufacturing. The survey specifically asks about stages of implementation for smart manufacturing within an organization, use of artificial intelligence/machine learning (AI/ML) for PCBA/SMT processes, use of digital twins for PCBA/SMT processes and use of digital twins for the electronics manufacturing industry.
Marco Van Oosterhout, Product Marketing Director for Kulicke & Soffa, recently talked with iNEMI about the importance of smart manufacturing solutions and encourages electronics manufacturing companies to participate in the iNEMI survey.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.