Northrop Grumman Begins Fabrication of Key NGI Components
June 20, 2022 | Northrop GrummanEstimated reading time: Less than a minute
Northrop Grumman Corporation’s Next Generation Interceptor (NGI) team recently began fabrication of integral throat entrances for the NGI solid rocket motors. This key milestone marks the beginning of manufacturing of key components for the NGI program. Produced at the company’s Bacchus facility in Magna, this hardware utilizes numerous Northrop Grumman advanced testing, inspection and development capabilities, including a specialized fiber weaving capability (pictured). This technology enables rapid development, prototyping and production for NGI to achieve the motor performance supporting this critical mission.
With over 60 years of mission-proven experience, Northrop Grumman with strategic partner Raytheon Technologies, has the technical expertise and operational manufacturing and test facilities needed to enable low risk, high performance propulsion solutions in support of the Missile Defense Agency’s (MDA) NGI program.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.