Inmarsat, hiSky Announce Successful Test Completion for New Cost-effective, High-value IoT Service Offering
July 5, 2022 | InmarsatEstimated reading time: 2 minutes
hiSky Ltd., a developer and provider of affordable and adaptable satellite IoT solutions, has today announced the successful completion of compatibility testing of its Smartellite terminals with the highly sophisticated, award-winning and high-speed Global Xpress (GX) network from Inmarsat, the world leader in global, mobile satellite communications.
The move marks the first step in a long-term partnership between the two companies, utilising Inmarsat’s geostationary (GEO) Ka-band capabilities to provide a low-cost, high-value offering to hiSky’s IoT customers. The technology will be available to customers active in enterprise sectors including agriculture, transport, mining, energy and utilities across selected territories.
hiSky’s proprietary Smartellite™ terminal technology has proven to communicate highly effectively with Inmarsat’s GX network – with its high-speed and reliable signals being received by ground infrastructure in Scotland and transferring throughout hiSky’s IoT network offering. This service enables the successful running of IoT devices, as well as voice calls and messaging for both mobile and static enterprise assets.
Mike Carter, President of Inmarsat Enterprise, said “Inmarsat is pleased to confirm the successful testing of hiSky’s technology with Inmarsat’s Global Xpress network. This partnership provides an exciting opportunity across a range of industries to speed up their IoT adoption through affordable and scalable solutions. It is part of our long-standing mission to increase the uptake of satellite-enabled IoT capabilities: from new entrants and disruptors, to established companies of any size.”
Through the partnership, hiSky and Inmarsat have uncovered an opportunity to leverage Inmarsat’s expansive GX network to provide customers with access to the world’s most sophisticated GEO global Ka-band satellite network, typically used by leading companies in the aviation and maritime industries. hiSky’s network is designed to operate within existing satellite networks, enabling fast deployment at minimum CAPEX cost.
The unique Smartellite™ low-data-rate network leverages the GX’s high throughput to harness IoT operations ideal for typical enterprise use cases, such as dynamic vehicle monitoring. The partnership will allow hiSky’s customers to benefit from a unique Ka-band-driven IoT solution supplied by Inmarsat’s proven resilient high speed and capacity offering.
Phil Meyers, General Manager at hiSky, added “Improved connectivity can be a game-changer for businesses located in remote, hard-to-reach locations – enhancing productivity, as well as maintaining the safety and wellbeing of those touched by the technology. We’re looking forward to progressing the partnership into use-case scenarios and partnering with major industry players to demonstrate the efficiencies, both in cost and in operations that Inmarsat’s GX network can provide to hiSky’s customers.”
Inmarsat’s abundant Ka-band capacity combined with hiSky’s cost-effective terminals will offer IoT solutions anywhere, affordably, for all remote industries. For customers looking to reduce upfront costs by spacing out their IoT investments, hiSky provides technology to enable businesses of all sizes to quickly scale up IoT monitoring across every touchpoint of their business, accelerating the rate at which they can benefit from the efficiency gains the technology brings.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).