Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Velodyne Lidar Signs Multi-Year Agreement with Stanley Robotics
September 27, 2022 | Business WireEstimated reading time: 2 minutes
Velodyne Lidar, Inc. announced a multi-year agreement to provide its lidar sensors to Stanley Robotics for an automated valet parking solution. The innovative service uses autonomous handling robots to help car parks to improve the customer experience and increase the number of vehicles that can be stored.
Stanley Robotics is working with Velodyne’s Puck and Velarray M1600 lidar sensors to provide perception and navigation capabilities that enable its all-electric Stan robot to operate autonomously and safely. The sensors provide real-time 3D perception data for localization, mapping, object classification and object tracking. Velodyne’s power-efficient sensors support Stan robots in a wide range of challenging environmental conditions, including varied temperature, lighting and precipitation.
The Stanley Robotics automated valet parking solution equipped with Velodyne sensors is already in operation in airports and finished vehicle logistics in Europe and Japan, with further deployments expected in 2023, including North America.
“High-performance sensors are key to enabling our autonomous mobile robots to reliably navigate and maneuver in narrow parking lanes,” said Mathieu Lips, COO, Stanley Robotics. “Velodyne’s lidar sensors deliver the performance for Stanley Robotics’ innovative solutions. This agreement reflects Velodyne's ability to serve the unique nature and high-level requirements of our use cases. This partnership with Velodyne also provides Stanley Robotics privileged access to best-in-class technology in the field of lidar sensors.”
“Stanley Robotics is transforming logistics for vehicles with its autonomous mobile robot technology,” said Laura Wrisley, Senior Vice President, Worldwide Sales, Velodyne Lidar. “Equipped with Velodyne’s lidar sensors, Stan robots provide the precision needed to safely move, park and deliver cars where and when customers need them. This advanced system aligns with efficiency and sustainability goals of car park operators, parking cars in dense blocks and relieving the need to add costly new parking areas.”
Stanley Robotics is partnered with Mitsubishi Heavy Industries, Ltd. (MHI) to deliver business opportunities in Japan and Asia-Pacific and collaborate on future industrial projects. The initiative combines Stanley Robotics’ advanced expertise in autonomous mobile parking robots and MHI’s industrial power. Also, MHI invested in Stanley Robotics technology to accelerate the delivery of value to customers.
Transforming Car Parks with Advanced Technology
Using the Stanley Robotics parking service, equipped with advanced autonomy technology utilizing Velodyne’s lidar, drivers leave their vehicles at a dedicated drop-off/pick-up area where the robot takes the car to a secure parking area not open to the public. When customers return, the car is waiting in the designated area, providing drivers with significantly enhanced convenience. The Stanley Robotics automated valet parking service, powered by Velodyne’s lidar, enables efficient use of limited parking space at airports, shopping malls and more, fitting more vehicles in a single line just centimeters apart. Car parks can then increase the number of cars in a given area by up to 50 percent.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.