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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

CoWoS-L to Remain Mainstream AI Chip Packaging Solution Through 2028

09/18/2026 | TrendForce
TrendForce’s latest research into advanced semiconductor packaging reveals that GPU suppliers and hyperscale CSPs are continuing to develop increasingly powerful and versatile AI chips, making larger package sizes a key development priority for 2.5D packaging.

Sony Semiconductor Solutions and TSMC Agreed to Establish Joint Venture for Next-Generation

08/11/2026 | TSMC
Sony Semiconductor Solutions Corporation and Taiwan Semiconductor Manufacturing Company Limited (TSMC) announced the execution of a legally binding definitive agreement for the establishment of Advanced Vision Semiconductor Manufacturing Corporation as a joint venture (JV) in Koshi City, Kumamoto Prefecture, Japan.

TSMC Expands U.S. Semiconductor Investment to $265B

07/22/2026 | U.S. Department of Commerce
The White House and the Department of Commerce announced an incremental $100 billion investment by TSMC for advanced semiconductor manufacturing and packaging facilities in Arizona.

Trump Administration Secures an Additional $100B U.S. Semiconductor Manufacturing Investment for a Total of $265B from TSMC

07/16/2026 | U.S. Department of Commerce
As a result of the historic deal related to U.S. and Taiwan Trade and Investment announced in January 2026, TSMC has just announced an incremental $100 billion investment for a total of $265 billion in the U.S

TSMC Reports Second Quarter EPS of NT$27.25

07/16/2026 | TSMC
TSMC announced consolidated revenue of NT$1,270.38 billion, net income of NT$706.56 billion, and diluted earnings per share of NT$27.25 (US$4.31 per ADR unit) for the second quarter ended June 30, 2026.
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