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INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates

03/12/2025 | iNEMI
If you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.

Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications

03/03/2025 | Rogers Corporation
Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.

Unveiling the Future: Insights on Next-Gen Megtron Materials 

02/13/2025 | Marcy LaRont, I-Connect007
In this interview from DesignCon, Jim Kenny, OEM business development manager at Panasonic, touches on next-generation Megtron materials and delves into the industry's growing demand for high-speed, low-loss laminate systems, particularly in light of the anticipated 224 gigabits per second technology. With a focus on material development and production timelines, Jim highlights the challenges and opportunities in meeting customer needs while also maintaining quality and supply chain stability. As Panasonic prepares for the evolving landscape, they remain committed to innovating in this competitive market.

DuPont Sets the Stage for Electronics Innovation at DesignCon 2025 Expo

01/29/2025 | DuPont
DuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4

01/02/2025 | I-Connect007
In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
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