Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Ventec Expands U.S. Team with New Director OEM Sales & Business Development
October 10, 2022 | VentecEstimated reading time: 1 minute
Ventec International Group Co., Ltd. is pleased to announce that Chad Wood has joined the company’s U.S. team. As Director OEM Sales & Business Development, Chad will drive business development, sales & support services for OEM customers predominantly in the Western region of the USA. His focus will be on Ventec’s core automotive, mil/aero, medical, lighting and network technology market segments, which typically require reliable thermal management materials (such as Ventec’s tec-thermal range) as well as high-speed and high-frequency material solutions (tec-speed).
Chad joins Ventec as an experienced technical sales leader who has worked in the electronics and semiconductor industries for more than 28 years. Since 2009, Chad has been involved in developing industry-leading thermal solutions for the most demanding applications that require sustainable and reliable materials that optimize product performance for tier-1 OEMs in the automotive, lighting, power and industrial, and telecom/datacom markets. From his home base in southern California, Chad will focus on bringing design wins and qualifications for all Ventec products from customers in the western region of the USA. He will also be responsible for Ventec's manufacturer rep sales teams on the west coast.
Chris Hanson, Global Head IMS Technology at Ventec comments: "Chad brings with him strong relationships with decision makers at the OEM and fabricator level. To support our continued growth, driven by a significant rise in demand for our solutions in the USA and beyond, our expanding team ensures that we continue to provide industry-leading technical support services. We are delighted to welcome Chad to Ventec as our latest member of the OEM sales team."
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
06/24/2025 | Mike Konrad -- Column: The Knowledge BaseAs the electronics manufacturing industry races to meet rising global demand and technological complexity, the need for a highly skilled, future-ready workforce has never been greater. At the forefront of addressing this challenge is The Electronics Manufacturing & Assembly Collaborative (EMAC)—a national initiative dedicated to strengthening the talent pipeline through strategic collaboration with SMTA, education, and government stakeholders.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.