Trackwise Designs Inks New Agreement with UK EV OEM
October 24, 2022 | Trackwise Designs PLCEstimated reading time: 2 minutes
Trackwise Designs, a leading provider of specialist products using printed circuit technology, is pleased to announce that, further to the Company's announcements on 14 September and 30 September 2022, it has concluded its discussions to replace the Product Manufacture and Supply Agreement (PMSA) for the supply of flexible printed circuit boards to its UK EV OEM customer ("EV OEM") and has agreed a new contractual arrangement with its customer.
The new agreement has been entered into for a fixed quantity of flexible printed circuit boards which are due to be delivered through to July 2023. The New Commercial Order provides for a £3.99 million advanced payment in 2022, with the balance of the contract value satisfied by standard payments on delivery of the products.
The advanced payment will be secured by a charge over various manufacturing assets involved in the production of the circuit boards at the new production facility at Stonehouse, Gloucestershire. The charge will be released upon completion of the supply of the full contracted quantity.
Completion of the new contract and release of the charge will conclude contractual arrangements between the two companies. Any further supply of existing parts or development of new parts for the EV OEM, will be under new arrangements to be agreed with the EV OEM.
As previously announced, the wider impact upon Trackwise of the lower production volumes for the EV OEM is that additional funding is required and Trackwise is reviewing a number of options for additional funding with its advisers and will provide further updates in due course. The orders under the New Commercial Order as detailed above are consistent with Trackwise's Base Case forecast as outlined in its interim results announcement of 30 September 2022.
In addition, Trackwise is actively exploring longer term strategic investment partnerships in order to support development and conversion of the very significant pipeline of identified IHT sales opportunities, notably for EV battery cell connection systems ("CCS") for UK and EU OEMs, with Trackwise as a Tier 1 or Tier 2 supplier, and also for other Medical and Aerospace sales opportunities.
Philip Johnston, CEO of Trackwise, commented:
"Both Trackwise and our EV OEM customer have been faced with delivering their respective innovations and capital projects against a massively challenging macro business environment. This has sadly led to the situation where the PMSA supply arrangement has had to be reset.
We remain convinced that the Stonehouse facility, as a state-of-the-art roll to roll FPC and FPCA facility, is the right investment at the right time, especially to meet the potentially very large future demand for EV CCS. The length-agnostic manufacturing process that we have developed and continue to develop, is of particular relevance for cell-to-pack application and Trackwise is actively bidding into a very large EV CCS sales pipeline (in excess of £1bn). We recognise that the scale of such a pipeline is likely to be beyond the balance sheet of Trackwise alone and we are therefore actively exploring longer term strategic investment partnerships with larger global businesses - who can, together with Trackwise, leverage our IHT patent and manufacturing know-how to meet this global demand."
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.