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March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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IPC to Unveil New Member Magazine ‘IPC Community’ at IPC APEX EXPO 2023
November 10, 2022 | IPCEstimated reading time: 1 minute
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
The quarterly magazine will be offered in a digital format and will serve as a valuable new resource designed to keep the IPC global community up to date on the latest IPC news, including industry updates, trends and technology.
The digital edition will be made available the week of January 22, 2023 at IPC APEX EXPO. The magazine will receive bonus circulation with printed copies exclusively available at the show.
Inside “IPC Community,” readers will find feature stories that celebrate member success along with articles on advocacy efforts, committee and standards updates, education and workforce training developments, factory of the future solutions, advanced packaging updates emerging engineer and member profiles, and more.
“Our members and the broader global electronics manufacturing community look to IPC as a steadfast resource to keep them informed and educated on the latest industry developments,” said Brian Knier, IPC vice president, marketing, member success and sales. “We’re excited about the possibilities of “IPC Community” taking our ability to disseminate timely and important information to the next level; all while making sure IPC members’ voices are reflected within the magazine.”
Added Michelle Te, IPC Community magazine managing editor, “Through its family of publications offering thought-provoking, original content, I-Connect007 prides itself in being ‘good for the industry.’ With the launch of IPC Community, IPC and I-Connect007 are now even better for the industry. There is much to recognize and celebrate.”
To subscribe to “IPC Community,” visit www.ipc.org/subscribe-ipc-community. For inquiries regarding advertising opportunities within the magazine, contact Barb Hockaday, ad sales manager, at barb@iconnect007.com. To suggest a member success story, contact Michelle Te at michelle@iconnect007.com.
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"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
TTCI’s Sam Fortna Actively Participates in IPC 2-40 Committee to Advance PCB and PCBA Standards
03/27/2026 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is proud to highlight the active involvement of Sam Fortna, Test Engineering Lead and Trainer, in the IPC 2-40 Committee, which develops standards for printed circuit boards (PCB) and printed circuit board assemblies (PCBA).
What APEX EXPO Award Recipients See for the Future of Electronics Manufacturing
03/27/2026 | Michelle Te, I-Connect007The single most transformative shift in the electronics manufacturing industry over the next decade will be the convergence of AI-driven design with advanced packaging architectures, according to some of the APEX EXPO 2026 award recipients, but success will rely on how well the industry bridges the talent gap. Recent award recipients express optimism over technological breakthroughs, from chiplet platforms and copper-to-copper hybrid bonding, to fighting the increasing incidence of conductive anodic filamentation (CAF) in flight hardware. Others see a workforce that can’t accelerate as quickly as the technology.
Educational Highlights From the APEX EXPO 2026 Show Floor
03/27/2026 | Kimberly Kutnick, Global Electronics AssociationAPEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.
Akrometrix Discusses AI Chip Board Demands
03/27/2026 | Real Time with... APEX EXPOPaul Handler of Akrometrix discusses the evolving demands in PCB fabrication, particularly the surge in large-format, room-temperature boards for AI chips. He highlights the critical need for inline, real-time testing of heavy, high-value circuit boards and Akrometrix's strategic shift towards integrated Industry 4.0 solutions. Handler also highlights the engineering challenges and the company's positive outlook for industry growth.
Balanced Approach Needed to Regulate PFAS in Electronics
03/25/2026 | Diana Radovan, Global Electronics AssociationThe very broad per- and polyfluoroalkyl substances (PFAS) group has widespread use in both consumer and highly specialized applications, including, perhaps surprisingly, green technologies. Among these, the fluoropolymers subgroup plays a complex and critical role in electronics. To date, there are hardly any technically comparable alternatives. The electronics industry is facing a major regulatory and business challenge as inconsistent policies on potential PFAS restrictions in electronics are emerging across regions worldwide, and, in the U.S., in different states.