-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
An Eye-opening User Group Meeting (UGM) Finale in ViTrox Campus 2.0
November 15, 2022 | ViTroxEstimated reading time: 1 minute
ViTrox, which aims to be the world’s most trusted technology company for the semiconductor and electronic packaging industries, is thrilled to announce that we will be hosting our upcoming User Group Meeting (UGM) in Malaysia very soon.
This UGM is considered our momentous one as it marks our final UGM for 2022, especially after hosting numerous ones internationally in various countries. This event marks our first in-house physical UGM in our Campus 2.0 after the pandemic, which we have been anticipating as it will be a great opportunity for us to meet up with our local and overseas customers after a long time. In addition to that, our valued customers will have the opportunity to personally experience our company culture and enjoy a warm welcome from us, on top of gaining the latest product information and technologies we offer. This one-day exclusive event will be held on 8th December 2022, from 0800 to 1830 (MYT), and hosted in our very own ViTrox Campus 2.0, located in Batu Kawan, Penang, Malaysia.
For this UGM, we aim to share the latest solutions and technologies that we provide to address the current SMT challenges faced by users. For the exclusive event, three keynote speakers will commemorate it with warm welcoming speeches, followed by informative and noteworthy product sharings. These sharings will revolve around ViTrox’s SMT PCBA Vision Inspection Solutions series, ranging from SPI, AOI, AXI, ARV, and V-ONE with live product demonstrations to uplift our customers’ product knowledge through deep-dive explanations! This unique, prestigious event will be highly beneficial as our valued customers will be able to understand the breakthrough technologies of ViTrox SMT inspection solutions and the current market trends better.
This event serves as a two-way interactive platform between ViTrox and our honorable customers. An added bonus about this event would be the spectacular networking opportunities for us and our valued customers as we will be having both local and international guests. With all these efforts, it would be a fruitful experience for our customers.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Micron First to Ship Critical Memory for AI Data Centers
05/01/2024 | MicronMicron Technology, Inc. announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
GPV’s Q1 2024 Interim Financial Report Shows Strong Navigation in Uncertain Times
05/01/2024 | GPVDanish-based GPV recorded an expected drop in sales to DKK 2.3 billion for the first quarter of 2024. The decline also affected the operating profit, which was DKK 155 million compared to DKK 179 million in the same quarter last year, although the EBITDA margin was maintained. In general, demand has been softer in 2024, but GPV continues to invest for the long-term and expects the trend to turn in the second half of 2024.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.