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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 3, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute

This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
EIPC Issues Letter of Urgency
Published April 29
From the news item, "The EIPC is calling on all European governments to recognize the existential threat to European PCB producers and to take urgent action to provide explicit assistance to reverse the trend and to kickstart renewed investment in both technology and capacity to meet current and future needs.” Learn more about how to support this awareness effort here.
USPAE to Springboard U.S. Technology Forward
Published April 30
The U.S. Partnership for Assured Electronics (USPAE) is working on an initiative to access to funding to develop a cooperative facility to develop ultra HDI capabilities for the whole of the U.S. electronics industry. Read more about their progress here.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
Published May 2
How can an intelligent system design methodology move some signal and power integrity decision-making into the physical design space, offering real-time feedback? Brad Griffin discusses exactly this in great detail in this latest installment of our podcast series with Cadence Design Systems.
The New Industry: Will the Growth Continue?
Published April 30
Given the sales numbers posted in this weeks’ Top 5, the question is, “How sustainable are the primary financial models in the United States regarding PCB fabrication shops?” In this interview with economic experts Shawn DuBravac and Tom Kastner, recorded at IPC APEX EXPO earlier in April 2024, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
North American EMS Industry Down 4% in March
Published April 29
These are not doom-and-gloom numbers. For EMS, the numbers are strong, but last year’s number was even stronger. Numbers are down in PCB and semiconductors too. Check out the rest of our market news.
Suggested Items
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
SEL Receives Purdue Senior Design Partner of the Year Award
05/01/2025 | Schweitzer Engineering LaboratoriesSchweitzer Engineering Laboratories (SEL) has been awarded the Senior Design Partner of the Year Award from the Edwardson School of Industrial Engineering at Purdue University.