Samsung Electronics, NAVER Team Up to Develop Semiconductor Solutions Optimized for Hyperscale AI
December 6, 2022 | Business WireEstimated reading time: 2 minutes
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, and NAVER Corporation, a global internet company with top-notch AI technology, announced a wide-reaching collaboration to develop semiconductor solutions tailored for hyperscale artificial intelligence (AI) models. Leveraging Samsung’s next-generation memory technologies like computational storage, processing-in-memory (PIM) and processing-near-memory (PNM), as well as Compute Express Link (CXL), the companies intend to pool their hardware and software resources to dramatically accelerate the handling of massive AI workloads.
“Combining our acquired knowledge and know-how from HyperCLOVA with Samsung’s semiconductor manufacturing prowess, we believe we can create an entirely new class of solutions that can better tackle the challenges of today’s AI technologies”
Recent advances in hyperscale AI have led to an exponential growth in data volumes that need to be processed. However, the performance and efficiency limitations of current computing systems pose significant challenges in meeting these heavy computational requirements, fueling the need for new AI-optimized semiconductor solutions.
Developing such solutions requires an extensive convergence of semiconductor and AI disciplines. Samsung is combining its semiconductor design and manufacturing expertise with NAVER’s experience in the development and verification of AI algorithms and AI-driven services, to create solutions that take the performance and power efficiency of large-scale AI to a new level.
For years, Samsung has been introducing memory and storage that support high-speed data processing in AI applications, from computational storage (SmartSSD) and PIM-enabled high bandwidth memory (HBM-PIM) to next-generation memory supporting the Compute Express Link (CXL) interface. Samsung will now join with NAVER to optimize these memory technologies in advancing large-scale AI systems.
NAVER will continue to refine HyperCLOVA, a hyperscale language model with over 200 billion parameters, while improving its compression algorithms to create a more simplified model that significantly increases computation efficiency.
“Through our collaboration with NAVER, we will develop cutting-edge semiconductor solutions to solve the memory bottleneck in large-scale AI systems,” said Jinman Han, Executive Vice President of Memory Global Sales & Marketing at Samsung Electronics. “With tailored solutions that reflect the most pressing needs of AI service providers and users, we are committed to broadening our market-leading memory lineup including computational storage, PIM and more, to fully accommodate the ever-increasing scale of data.”
“Combining our acquired knowledge and know-how from HyperCLOVA with Samsung’s semiconductor manufacturing prowess, we believe we can create an entirely new class of solutions that can better tackle the challenges of today’s AI technologies,” said Suk Geun Chung, Head of NAVER CLOVA CIC. “We look forward to broadening our AI capabilities and bolstering our edge in AI competitiveness through this strategic partnership.”
Suggested Items
SCHMID Group Closes Business Combination, Begins Trading on NASDAQ
05/02/2024 | SCHMID GroupGebr. SCHMID GmbH, a global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, and Pegasus Digital Mobility Acquisition Corp. announced the completion of their business combination.
Real Time with… IPC APEX EXPO 2024: Sigma Engineering's Recycling and Regeneration Systems for PCB Etching
05/02/2024 | Real Time with...IPC APEX EXPOEvan Howard of Schmoll America interviews Kristoffer Bjorklund, Sigma Engineering's supply chain manager. We learn about Sigma's recycling and regeneration systems for PCB industry etching and the benefits and challenges of implementing these systems in existing factories.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
Real Time with… IPC APEX EXPO 2024: The Latest Advancements in Dry Storage
04/30/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont and Super Dry Totech's Jordan Mandel discuss the latest developments in dry storage solutions, the J standard, and the ongoing challenge of moisture management while highlighting the industry's shift toward smart solutions and the importance of seeking expert help for moisture mitigation.
Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard
04/30/2024 | Keysight TechnologiesKeysight Technologies, Inc. has validated new conformance test cases for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks (NTN) using narrowband internet of things (NB-IoT) technology.