The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
The holiday season is in full swing for most of us; no matter which holiday you choose to recognize here in the second half of December, it’s almost certain that your routine has some level of interruption to it right now. Chances are, you might not be consuming as much of your usual diet of industry news and information, what with all the holiday treats and traditional meals to be consumed instead. That, gentle reader, is why we bring you this week’s Top 5 editor’s picks–your slimmed down version of the news, leaving you more time for the other delights of the season. So without further ado, we bring you the five news items you really should make room for this week.
And, as ever, the staff at I-Connect007 wish you a healthy, happy, joyous holiday season.
ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event
Published December 13
The best way to introduce this dispatch from the Institute of Circuit Technology’s Christmas Seminar, is to quote Pete Starkey’s opening paragraph:
“Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme.”
Starkey’s reporting from the technical conference field is highly sought after reading for so many of us, and this report does not disappoint. Definitely recommended reading.
Pan Pacific Microelectronics Symposium 2023 Program Finalized
Published December 14
The program for the 27th Annual Pan Pacific Microelectronics Symposium has been finalized. The event, which will take place from Jan. 30 to Feb. 1, 2023, at the Sheraton Kauai Resort on Kauai, Hawaii, promotes international technical interchange and provides a premier forum for global networking among microelectronics professionals and business. Read more here for details.
Physics, Electrical Engineering, and PCB Design
Published December 9
Tamara Jovanovic is a periodic contributor to Design007 magazine, and an insightful voice of the young PCB design professional. In this article, published in the November 2022 issue, which we themed “Maxwell vs. Moore: A Fight to the Physics,” Jovanovic delves into how her classroom education and her daily professional life intersect in useful and interesting ways. Readers definitely responded to her writing.
Industry Innovation Starts Here
Published December 9
If you haven’t already started planning your trip to IPC APEX EXPO in San Diego, then it’s definitely time to start. This news piece, courtesy the IPC conference staff, calls out six key reasons that you—or someone from your team—should be at the conference. Helpful tips for getting the greatest value for your registration dollar are included. Give it a read, then book your plane tickets.
EIPC: Europe’s Energy Disadvantage
Published December 15
In this interview, EIPC’s Alun Morgan details the unsettling realities facing the European PCB industry due to the current war in Ukraine, and outlines steps that the EIPC plans to take to help raise awareness of the possible perils the industry might face as a result.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Simplifying Software Integration for Every Factory
10/22/2025 | Nolan Johnson, SMT007 MagazineAs a leading provider of factory digitalization solutions for electronics manufacturers, Cogiscan is at the heart of the software integration process. Davina McDonnell, director of marketing and product management, discusses how Cogiscan ensures that customers are ready to integrate and what it looks for to ensure a quick and appropriate installation.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.