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December 2022 Issue of PCB007 Magazine Available Now
December 20, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 1 minute

It's almost 2023, and we’re looking forward to meeting up with many of you at IPC APEX EXPO 2023. There’s a lot of excitement around this show, and the event is shaping up to match expectations. This year, IPC APEX EXPO has 373 exhibitors signed up, and more classes—with better content—in the Professional Development and Technical Conference sections than we can remember. So, in this month’s issue of PCB007 Magazine, we bring you a preview of IPC APEX EXPO 2023.
This month, we bring you articles and interviews with show organizers, committee leaders, and instructors. We even have one article designed to help you justify to your manager why you need to attend this show.
And once you’re on the show floor, stop by and chat with us. We’ll be manning our state-of-the-art I-Connect007 booth throughout the week. Editors and guest editors will be conducting scores of Real Time with… I-Connect007 video interviews with the industry’s top engineers, managers, and executives.
We hope you all have a fantastic holiday season, and hope to see you in San Diego next month. Have a Happy New Year!
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.