-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Indium Corporation Announces Two Updates to Suzhou Team
December 23, 2022 | Indium CorporationEstimated reading time: 1 minute

Indium Corporation is pleased to announce two updates to its team based in Suzhou, China—Fiona Chen has been promoted to the position of Senior R&D Manager and Demi Yao has been promoted to the position of R&D Sintering Project Manager.
In her new role as Senior R&D Manager, Chen assists with the development and implementation of departmental vision, pillars, and best practices to achieve Indium Corporation’s mission of developing world-class materials. Additionally, she is responsible for building and managing the R&D staff at the company’s Suzhou facility. She leads her team in designing and performing laboratory R&D work to develop products on a timely basis to increase customer satisfaction and sales.
Chen joined Indium Corporation in 2008 as a Research Chemist. In 2014, she was promoted to R&D Manager, where she led her R&D team to success in the development of ultra-low-voiding Indium10.1HF solder paste and Cu sinter paste. Chen received her master’s degree in polymer science from Soochow University in China.
In her new role as R&D Sintering Project Manager, Yao manages the research and development of advanced sintering projects by identifying opportunities to collaborate with customers. She collaborates with, and uses input from, marketing and sales team members, as well as customers, to design and develop new materials.
Yao joined Indium Corporation in 2015 as a Research Scientist for sintering materials. In this role, she successfully developed Nano/MicroCu Sintering paste. Yao earned her Ph.D. from Central China Normal University in Wuhan. She was a member of the Chinese-American exchange Ph.D. program, where she studied at the University of Kentucky during the first year of her Ph.D. program. In 2017, Demi was awarded the IMPACT “Best Paper Award.”
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.