Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
September 18, 2025 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
As demands grows for higher power densities and advanced packaging, MacDermid Alpha’s experts will showcase and present material solutions engineered to boost the reliability and performance of semiconductors within electric vehicles (EVs) and renewable energy applications.
Spotlight on ALPHA® Argomax® BondPad™
Making its debut ahead of its commercial launch later this year, ALPHA Argomax BondPad combines a SinterReady™ copper foil with integrated Argomax® nano-silver sinter film. The innovative material enables low-temperature, low-pressure die topside interconnects, while supporting both wire and ribbon bonding. With controlled bondline thickness around 20 microns, BondPad™ enhancing process efficiency and provides a robust alternative to sintered clips and a fully sintered die system when paired with a compatible die attach material.
Technical Presentation
In addition, to its product showcase Hu Liu Chang, Application Lab Manager at MacDermid Alpha, will present research titled: ’Investigation of Large Area Solder with TrueHeight™ Preforms on Bare Cu Substrates’. This study delivers a practical solution to one of the most persistent challenges in power module assembly: maintaining uniform solder joint thickness and thermal performance when attaching large area dies to copper substrates. By using TrueHeight™ engineered solder preforms, manufacturers can achieve consistent joint integrity, reduce voiding, and improve long-term reliability in high-power applications.
MacDermid Alpha welcomes all PCIM Asia attendees to Booth N5-E30 to learn how its advanced materials are shaping the future of high-reliability in next-generation power electronics systems.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
MacDermid Alpha Expands Laboratory Facilities in Thailand to Strengthen Regional Innovation and Customer Collaboration
10/23/2025 | MacDermid AlphaMacDermid Alpha Electronics Solutions, a global leader in chemicals and materials for electronic manufacturing, announced the opening of its expanded laboratory in Bangkok, Thailand.
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
10/07/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignFor years, Midwest PCB manufacturing was often viewed as a low-cost, high-volume business—good for standard builds but not for the high-reliability programs that demand tight process control. Defense primes and medical OEMs frequently turned to coastal or overseas suppliers for advanced work.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider
08/28/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.