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MacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
As demands grows for higher power densities and advanced packaging, MacDermid Alpha’s experts will showcase and present material solutions engineered to boost the reliability and performance of semiconductors within electric vehicles (EVs) and renewable energy applications.
Spotlight on ALPHA® Argomax® BondPad™
Making its debut ahead of its commercial launch later this year, ALPHA Argomax BondPad combines a SinterReady™ copper foil with integrated Argomax® nano-silver sinter film. The innovative material enables low-temperature, low-pressure die topside interconnects, while supporting both wire and ribbon bonding. With controlled bondline thickness around 20 microns, BondPad™ enhancing process efficiency and provides a robust alternative to sintered clips and a fully sintered die system when paired with a compatible die attach material.
Technical Presentation
In addition, to its product showcase Hu Liu Chang, Application Lab Manager at MacDermid Alpha, will present research titled: ’Investigation of Large Area Solder with TrueHeight™ Preforms on Bare Cu Substrates’. This study delivers a practical solution to one of the most persistent challenges in power module assembly: maintaining uniform solder joint thickness and thermal performance when attaching large area dies to copper substrates. By using TrueHeight™ engineered solder preforms, manufacturers can achieve consistent joint integrity, reduce voiding, and improve long-term reliability in high-power applications.
MacDermid Alpha welcomes all PCIM Asia attendees to Booth N5-E30 to learn how its advanced materials are shaping the future of high-reliability in next-generation power electronics systems.
