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Integra: Redefining Die Prep in the U.S.
January 25, 2023 | Matt Bergeron, IntegraEstimated reading time: 1 minute
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.
For over 40 years, Integra has held its position as the largest outsourced semiconductor assembly and test (OSAT) operation in the U.S.—an accomplishment considering that most of our competition (and a few of our former owners) have given up on manufacturing in the U.S. altogether. Five years ago, customers and suppliers were saying things like, “When are you opening a facility in Asia?” and “What volume facility are you tied to?” Having a factory in the U.S. was considered laughable.
But with the arrival of COVID-19 and all its supply chain disruptions—not to mention the current precarity of global politics—there came a realization that we are increasingly dependent on Asia for manufacturing. The CHIPS Act has generated new discussions; now we hear comments like, “We’ve said all along that we need to bring manufacturing back to the U.S.,” and “We’re building a factory here too.” People who laughed when we had a U.S. presence are now asking if we can help them get substrates sooner.
While most folks were moving out of the United States, we were looking for ways that we could make U.S. manufacturing work. We focused on two core ideas: products that are differentiated, and customers that can’t or won’t go to Asia.
With respect to differentiated products, we specifically targeted unique processes, such as SiPho, III-V materials, etc.; unique and unruly requirements in low-volume quantities (qualification runs, DPA, test, etc.); and volumes that Asia typically will not accept. This last criterion also happened to fit with the space technology sector quite well.
To read this entire article, which appeared in the January 2023 issue of SMT007 Magazine, click here.
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