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Planning Technology for the Future: From the Eyes of Intel
April 10, 2007 | IPCEstimated reading time: 1 minute
Technology is always advancing, but has it advanced enough to meet customer demands? To facilitate an effective and synchronized response, IPC -- Association Connecting Electronics Industries and Intel Corp. have announced a technology interchange, "Where Are We Going? Where Do We Need to Be?" The one-day forum will be held May 23, 2007 at the Holiday Inn Portland, Oregon Airport (USA).
During the forum, Intel will reveal its vision of the future and provide its requirements for the supply chain. Discussions will include the inevitable transition to HDI (high-density interface), the underlying challenges in making advancements in package scaling and associated board density, and activities to create pull for HDI PCBs from the OEM and ODM communities.
Answering the call to action, nine of the industry's leading suppliers will explain the supply chain's abilities, in areas from alternative alloys to underfill solutions, and will present area gap analyses.
For more information or to register for "Where Are We Going? Where Do We Need to Be?" visit www.IPC.org/Intel2007 or contact Susan Filz, IPC industry programs project manager, at +1 847-597-2884 or SusanFilz@ipc.org.
About IPC
IPC (http://www.ipc.org/) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,400 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.