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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
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Latest News

Quilter Secures $25M Series B to Eliminate Manual PCB Design with Physics-Driven AI
New Today | BUSINESS WIRE



I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/08/2025 | I-Connect007




How Does UHDI Improve Routing Capabilities? Listen to Episode 3 Now and Discover
09/29/2025 | I-Connect007

Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration
09/22/2025 | Global Electronics Association


American Standard Circuits to Exhibit and Host Lunch & Learn at PCB West 2025
09/17/2025 | American Standard Circuits



I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007

The Signal Integrity Issue: Design007 Magazine September 2025
09/09/2025 | I-Connect007 Editorial Team



New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007

Pentalogix Launches ViewMate Essentials to Ensure PCB Designs are Manufacturing-Ready
09/03/2025 | PentaLogix

The Global Electronics Association Launches Design Village at APEX EXPO 2026
09/02/2025 | Global Electronics Association





Polar Instruments Announces Additive Transmission Line Support for Si9000e
08/20/2025 | Polar Instruments



New Podcast Episode Drop: Understanding How Chemistry and Drilling Collaborate for OTI
08/11/2025 | I-Connect007

Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics Association

Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)
Flexible Circuit Technologies Welcomes Regional Business Development Manager Derek Rossberg
07/15/2025 | Flexible Circuit Technologies
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/16/2025 | I-Connect007
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics Association
New Companion Guide to ‘DFM Essentials’ Delivers Deeper, Practical PCB Design Insights
06/09/2025 | I-Connect007
Polar Brings New Book 'The PCB Designers Guide to... More Secrets of High Speed PCBs' to EIPC Edinburgh
05/27/2025 | Polar Instruments
Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams
05/21/2025 | Siemens
Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP
05/19/2025 | Electroninks
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007
TTM Board of Directors Approves New $100 Million Share Repurchase Program
05/14/2025 | TTM Technologies, Inc.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard Circuits
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial Team
The EEcosystem and Dr. Eric Bogatin Launch Free Masterclass for Electronics Engineers
05/01/2025 | The EEcosystem
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