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Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: Key SI Considerations for High-speed PCB Design

Matt Stevenson, ASC Sunstone Circuits
Matt Stevenson covers solutions to help your PCB projects succeed.
Latest Column: Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights

Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: The Ten Faces of Innovation

Dana Korf, Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: The Missing AI-NPI Link

Patrick Crawford, IPC
Patrick Crawford provides updates on IPC Design activities.
Latest Column: Design Circuit: Green Ambition for the Electronics Manufacturing Industry

Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Latest Column: Designers Notebook: Addressing Future Challenges for Designers

John Watson, Palomar College
John Watson covers a variety of tips that designers need to know.
Latest Column: Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication

Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Latest Column: Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA

Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer

IPC Education Foundation, IPC
IPC Education Foundation updates on programs and activities.
Latest Column: Foundations of the Future: Awarding Scholarships and Awards in 2023

Team NCAB, NCAB Group
A variety of field application engineers from NCAB Group's technical team explore fresh PCB concepts.
Latest Column: Fresh PCB Concepts: Traceability in PCB Design

Tom Yang, CEE PCB
Tearing down the walls and cultural silos to make the world a better place for PCB manufacturing.
Latest Column: Global Citizenship: Training the Next Generation of Talent

Jerome Larez, CEE PCB
An American field engineer talks technology from the point of view of working for an Asian PCB fabricator selling in North America.
Latest Column: Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch

Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Latest Column: It’s Only Common Sense: Being Your Customer’s Expert—The Key to Consultative Sales

John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year

Istvan Novak, Samtec
Focusing on signal and power integrity issues related to PCB design and design engineering.
Latest Column: Quiet Power: An Evolution in PCB Design Costs

Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: Anticipating Customer Needs Early and Often

Kelly Dack, EPTAC Corporation
Kelly’s column pursues the need for stakeholder advocacy in the printed circuit industry head-on, deliberating topics essential for helping one another achieve 100% acceptability in PCB engineering, design, procurement, sales, manufacturing, test and inspection.
Latest Column: Target Condition: Designing vs. Inventing

Mehul Davé, Linkage Technologies
Mehul's column explores issues surrounding globalization and the electronics supply chain.
Latest Column: The Big Picture: The Shift From China to Southeast Asia

Chris Mitchell, IPC, Global Government Affairs
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: Four Things to Know About IPC Advocacy in 2025

Brittany Martin, I-Connect007
Lighting up the industry with marketing ideas that connect, engage, and inspire.
Latest Column: The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend

Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?

Andy Shaughnessy, I-Connect007
Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.
Latest Column: The Shaughnessy Report: Always With the Negative Waves