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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: High-speed Rules of Thumb
Matt Stevenson, Sunstone Circuits
Matt Stevenson covers solutions to help your PCB projects succeed.
Latest Column: Connect the Dots: Designing for Reality: Strip-Etch-Strip
Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: ‘Born to Create’
Dana Korf, Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
Patrick Crawford, IPC
Patrick Crawford provides updates on IPC Design activities.
Latest Column: Design Circuit: Green Ambition for the Electronics Manufacturing Industry
Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Latest Column: Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
John Watson, Palomar College
John Watson covers a variety of tips that designers need to know.
Latest Column: Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Latest Column: Fein-Lines: AI, Big Data, and A Lot of Trade Shows
Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: Rules of Thumb—A Word to the Wise
IPC Education Foundation, IPC
IPC Education Foundation updates on programs and activities.
Latest Column: Foundations of the Future: Awarding Scholarships and Awards in 2023
Team NCAB, NCAB Group
A variety of field application engineers from NCAB Group's technical team explore fresh PCB concepts.
Latest Column: Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
Tom Yang, CEE PCB
Tearing down the walls and cultural silos to make the world a better place for PCB manufacturing.
Latest Column: Global Citizenship: What I’ve Learned About the American PCB Business
Jerome Larez, CEE PCB
An American field engineer talks technology from the point of view of working for an Asian PCB fabricator selling in North America.
Latest Column: Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Latest Column: The Power of Consistency: Showing Up Every Day is Half the Battle
John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Mastering Technology Prognostication
Duane Benson, Positive Edge, LLC
Duane offers tips and tricks for PCB assembly issues.
Latest Column: Powerful Prototypes: Small Computer Modules
Istvan Novak, Samtec
Focusing on signal and power integrity issues related to PCB design and design engineering.
Latest Column: Quiet Power: An Evolution in PCB Design Costs
Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
Kelly Dack, EPTAC Corporation
Kelly’s column pursues the need for stakeholder advocacy in the printed circuit industry head-on, deliberating topics essential for helping one another achieve 100% acceptability in PCB engineering, design, procurement, sales, manufacturing, test and inspection.
Latest Column: Target Condition: My Anti-venom to PCB Cost Adders
Mehul Davé, Linkage Technologies
Mehul's column explores issues surrounding globalization and the electronics supply chain.
Latest Column: The Big Picture: The Shift From China to Southeast Asia
Pete Starkey, I-Connect007
This varied column has a decidedly technical content with a European flair.
Latest Column: CircuitData: A New Open Standard for PCB Fab Data Exchange
Chris Mitchell, IPC, Global Government Affairs
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: Support for Defense Spending Takes Top Priority
Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Commonsense Cost Cutting
Andy Shaughnessy, I-Connect007
Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.
Latest Column: The Shaughnessy Report: A Stack of Advanced Packaging Info