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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.

Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling

Designers commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.

Designing for Reliability: Why Understanding Materials, Cleanliness, and Lifecycle Matters More Than Ever

Before a product enters manufacturing—long before the first panel hits the assembly line—its reliability is determined by a series of fundamental design decisions. At productronica, Tiberiu (Tibi) Baranyi of Flex presented a comprehensive presentation on design for reliability, providing real-world case examples that illustrated the unfortunate outcomes of decisions that caused failures, and which should have been made differently.

MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics

The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Lately, I’ve been thinking a lot about storytelling. Partly because I’m reading "Creativity, Inc.," by Ed Catmull, and partly because it’s impossible to separate Pixar’s success from the power of the stories it tells, both on screen and behind the scenes. Everything matters to Pixar—from the technology to the leadership—but what makes Pixar truly special is the stories it tells about human emotions. They make our human complexity understandable.

The Evolution of PCB Design from 2D Layouts to 3D Structures

Kris Moyer is an experienced PCB designer, instructor, and industry expert with a strong focus on advancing design best practices and workforce development. As an instructor at Sacramento State University, he helps prepare the next generation of electronics designers. He also serves as an instructor for the Global Electronics Association, delivering professional training aligned with IPC standards and emphasizing practical, manufacturable design practices.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I was in Chicago this week, where the weather went from sunny and 45° F on the day I arrived to snow and ice by the next morning. As a California/Arizona native, let’s just say I love the look of snow much more than I love driving in it.  Still, I am grateful to have been part of some genuinely fun teambuilding with my colleagues at the Global Electronics Association. My must-reads for this week are a diverse grouping of articles and columns, ranging from printed electronics and additive manufacturing to a comprehensive overview of the European EMS and PCB markets to marketing wisdom and, finally, a book to help you reach your full potential, personally and professionally.

Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging

The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.

Where Electronics Manufacturing Turns for Trusted Technical Insight

In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.

Solving the Puzzle of a Work-Life Balance

Experts say that maintaining a proper work-life balance can lead to happier employees overall and increased productivity on the job. For me, the work-life balance can be a constant troublesome issue as I tend to lean more toward enjoying overworking and putting aside life issues and options. I admit I am a workaholic even into my golden senior years of engineering employment. I can’t help it; I enjoy solving problems and puzzles and producing solid engineering solutions.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Happy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”

Design007’s Top 10 Reader’s Picks for 2025

The design dynamic duo, Design007 Magazine and the Design007 Week newsletter, covered a wide range of topics in 2025. Here are the top 10 design-related articles, columns and news reports for the year. This list, comprised of two columns, three articles, and five news items, relies entirely on readership numbers, making for as fair a comparison as possible. 

I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future

I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?

Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec

Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.

How a Business Owner Builds Boundaries

Complete discipline to an exercise routine has been key to helping PCB designer and business owner Zach Peterson relieve stress. Though running a company leaves little room to completely disconnect, he protects evenings and weekends for his family. His advice: Treat your health, relationships, and personal time as essential investments, not afterthoughts.

UHDI Fundamentals: An Overview of UHDI Layer Types

UHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.

I-Connect007 Editor's Choice: Five Most-Read Articles for 2025

Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.

Advance Your Electronics Career in 2026: Upcoming Instructor-Led Courses from Electronics U

Staying competitive in the electronics industry requires continuously strengthening your technical expertise. Electronics U is excited to present a new lineup of expert-led, online courses designed to elevate your skills in PCB design, electronics assembly, wire harness design, program management, and more. Whether you're looking to build foundational knowledge or expand into specialized applications, these immersive, instructor-guided sessions will help you master the tools and techniques that today’s leading companies rely on.

Kelly Atay: Work-Life Balance for a Marketing Professional

Kelly Atay has one piece of advice: Don’t wait until you’re burnt out. Balance requires intentional choices and consistent practice. As the sales and marketing manager at ASC Sunstone Circuits, Kelly often feels herself being pulled in many directions. This interview examines her ongoing efforts to achieve a healthier work-life balance. While it’s generally positive, Kelly is still learning to set stronger boundaries, and uses audiobooks during her commute as a daily reset time.

Happy New Year from the I-Connect007 Staff

The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.

Brittany Martin: A New Champion for the Industry

From Shakespeare scholar to digital marketer, Brittany Martin brings clarity and heart to everything she does. In this interview, Brittany shares her journey from academia to electronics marketing, her proudest professional and personal milestones, and the lessons she’s learned about simplicity, growth, and balance along the way. Get to know the person behind The Marketing Minute and discover what drives her passion for this industry.

John Perry: From Mailing IPC Standards to Guiding Them

John Perry's journey with the Global Electronics Association (formerly IPC) started when he was 8 years old, inspired by his mother's role in organizing IPC company meetings. Driven by his passion for aviation and standards, he went on to a career in computer science and IT. Today, he is the director of Printed Boards Standards & Technology for the Association, collaborating with industry leaders, including those at Lockheed Martin.

A PCB Engineer’s Heartfelt Blueprint for a Life Without Regrets

As PCB engineers, we are puzzle solvers, innovators, and scrupulously detail-oriented wizards of the PCB world. We pour so much of ourselves into our designs, meticulously crafting every detail, and sometimes it feels like our personal lives become just another “component” we’re trying to fit onto an already crowded board. But trust me, designing a robust and reliable life means paying just as much attention to your personal “circuitry” as you do to your professional ones.

Merry Christmas from I-Connect007!

The I-Connect007 offices are closed today, in observance of the Christmas holiday. As part of the Global Electronics Association, the offices remain closed through New Year’s Day. I-Connect007 will still publish daily and weekly newsletters (with the exception of Christmas and New Year’s Day). Some staff members will still be checking email. Just for fun, we thought we’d share a bit of Christmas tradition about the gingerbread house. You’ve likely built one at some point and perhaps wondered how this tradition originated.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Before diving into this week’s must-reads, I want to spotlight the incredible batch of interviews our team captured at productronica. They go beyond the quick booth chitchat and dig into the most pressing topics in electronics manufacturing. We spoke with companies and leaders who are shaping what happens next, and the conversations touch on the challenges and innovations that matter most to the industry today.

Pan-European Electronics Design Conference Returns Better Than Ever

Following a highly successful inaugural event, the Pan-European Electronics Design Conference (PEDC) returns, this time to Prague, Czech Republic, Jan. 21–22, 2026. In this Q&A, Peter Tranitz, the Global Electronics Association’s senior director of technology solutions, shares the value of attending PEDC, which aims to bring together PCB designers from across Europe to learn, network, and share their own knowledge.

I-Connect007 Announces the December Issue of Advanced Electronics Packaging Digest

Landing in inboxes Monday, Dec. 15, the next issue of Advanced Electronics Packaging Digest (AEPD) explores some of the most pressing questions shaping U.S. advanced electronics capability, from defense readiness to power constraints and the fast-moving world of printed electronics. This month, we spotlight the technologies, strategies, and industry perspectives driving next-generation manufacturing forward.

Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts

Ventec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.

Understanding Agentic AI

For those of us who design, build, and use computers, AI is our most frequent topic of conversation. Next to that is agentic AI, a form of artificial intelligence designed to function autonomously. But how is it different from traditional and generative AI? Simply said, agentic AI can execute complex tasks autonomously with little or no human intervention.

Real Time with... productronica 2025: Polar on Understanding Material Libraries in Design

Pete Starkey and Martyn Gaudion discuss the rapid updates in material libraries and the critical need for designers to grasp material properties. They highlight the role of suppliers and the importance of communication between designers and fabricators. Martyn focuses on the educational aspect of their services, aiming to connect design and manufacturing. The conversation underscores the significance of material knowledge in enhancing the design process through collaboration.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Yesterday was the U.S. Thanksgiving holiday. The traditional meal is, of course, roast turkey with “all the trimmings.” Although not everyone observes that menu, most do, and it was reported that 42 million turkeys were consumed on that day. With an average weight of 16 pounds per turkey, we cooked up 672 million pounds! With approximately 342 million people in the U.S, that pencils out to just under two pounds of drumstick and white meat per person. That, my friends, is a whole lot of leftovers.

I-Connect007 Closes for Thanksgiving Day

I-Connect007 recognizes Thanksgiving Day and its office will be closed Nov. 27–28, 2025. The Thanksgiving holidays, as celebrated across North America, trace their roots to early harvest celebrations, expressions of gratitude, and moments of national significance. In Canada, Thanksgiving is often linked to explorer Martin Frobisher’s 1578 Arctic expedition, where he held a ceremony giving thanks for a safe passage—decades before the Pilgrims arrived in North America.

Power Integrity: Effective Decoupling Radius

Power delivery on modern systems is an important and challenging problem facing hardware designers. These challenges are even more apparent as device operating speeds and current demands increase. Modern FPGAs, processors, and other devices feature fast switching currents and demand precise voltage levels.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Were you one of the lucky ones who made it to Europe’s largest electronics trade show this week? By all accounts, this massive event was buzzing with new technologies, packed booths, and plenty of tired feet by the end of each day. So, if you’re heading home from productronica (or, like me, just enjoying the end of a busy week), now’s the perfect time to unwind a bit. Settle into that airplane seat (or office chair), grab a snack, and catch up on some great reads from I-Connect007.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I read an interesting article this week about a breakthrough on building microprocessors to run on microwaves rather than traditional digital circuitry. It cites an academic study that begins, “The development of high-bandwidth applications, including multi-gigabit communication and radar imaging, demands faster processing. However, in the microwave regime, where frequencies exceed clock rates, sampling and computation become challenging. Here we report an integrated microwave neural network for broadband computation and communication.”

UHDI Fundamentals: An Overview of UHDI Substrate Materials and Vias

The rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design

Advanced Electronics Packaging Digest: Third Issue Arrives November 17

The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly. 

Everyone’s Talking About Power

Delivering power to a digital load is an AC function, not DC. That simple statement may be obvious, but the implications of how electricity travels to an electronic load are complicated. Dynamic loads with rapidly changing currents create electric and magnetic fields that adhere to Maxwell’s equations. Ground can be misleading and is probably better used for describing where one grows potatoes and carrots. Electrical currents have “return paths,” and the energy is traveling in the fields between the power rail and the return path.

UHDI Fundamentals: UHDI Technology and Automated Inspection

Following up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.

Sealed for Survival: Potting Electronics for the Toughest Environments

Electronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we have quite a bit of international content in this week’s list of must-reads. Nothing happens in a vacuum, including electronics manufacturing and design, and this has been quite an eventful year. How many of us are now tariff experts? I’m certainly not, but that hasn’t stopped me from opining about the situation.

PDN Optimization: Balancing Performance and Cost in SoC Designs

This article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.

Global Electronics Association Releases Fall Schedule of Instructor-led Courses

Whether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.

Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics

As power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.

The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics

I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.

Taking Control of PCB Verification One Step at a Time

Today’s designs are as complex as ever, and engineers face tough decisions every day. Simulation and verification teams are confronted with a three-fold challenge: understanding the underlying theory, mastering the tools, and applying best practices.Engineers need to navigate a vast and ever-changing cast of design and simulation tools, often with overlapping functionality.

EDADOC Ushers in a New Era of Robotics Innovation

On Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.

New Fil Arzola Class: Designing for the Future, and for Sustainability

If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week. We’ve been covering PCB West, and we’ll be bringing you a variety of news and interviews from the show in the next few weeks. We’ll also be attending SMTA International later this month, and productronica as trade show season rolls on. This week, we have a number of interesting columns and news items. We start with a positive story about North American PCB sales, which were heading in the right direction in August. Don Ball writes about the ins and out of working with overseas partners, and there’s a great column by Dan Beaulieu on avoiding the temptation to offer discounts when your customer gets squirrely.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Though the news cycle felt a little less exclamatory this week, there were many global business news headlines worth revisiting. Among them, China announced a bold carbon emissions goal of 10% over the next decade to double its solar and wind power capacity. The Wall Street Journal published an article, “Global Port Leaders See Trade Shifting, Not Slowing,” a nod to businesses’ risk mitigation strategies and execution around overreliance on China coming into play in a bigger way.

Signal Integrity: A Game of Margins

As the founder of Wild River Technology, Al Neves deals with some of the most challenging aspects of signal integrity. Wild River’s engineers consult with high-tech companies that work at very high speeds and frequencies, often above 100G. Al is always a fun interview, so we asked him to share his thoughts on the current state of signal integrity engineering.

Understanding Signal Integrity, the Foundation of High-Speed Digital Design

Signal integrity has become a critical factor in ensuring reliable performance in high-speed digital systems. As data rates continue to increase, engineers must understand the fundamental principles that govern how signals propagate through transmission lines and how to mitigate common issues that can degrade signal quality.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We definitely have advanced packaging on our minds this week at I-Connect007. We just launched our monthly “Advanced Electronic Packaging Digest,” and we’re feeling the excitement. Whenever we find ourselves in the middle of a technological sea change, we’re in for some fun.

UHDI Fundamentals: UHDI Technology and Quality 5.0

The convergence of ultra-high density interconnect (UHDI) technology and Quality 5.0 represents a transformative leap in electronics design and manufacturing. UHDI enables extreme miniaturization and enhanced performance, while Quality 5.0 delivers adaptive, intelligent human-centric quality systems. Together, they set the foundation for advanced electronics that are smarter, more resilient, and more sustainable.
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