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UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2

​​​​​​​Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week. 

Are Our Stackup Rules No Longer Valid?

Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.

Spotlight on PEDC: Filbert Arzola 

IPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.

Kickstart 2025 With Advanced PCB Design Skills

As the new year approaches, it's the perfect time to set your professional goals and enhance your expertise in the dynamic field of electronics. IPC's January and February 2025 lineup offers a variety of courses designed to meet the needs of professionals at every level of their career, from beginners to seasoned experts. Whether you're looking to delve into the intricacies of radio frequency PCB design, tackle the challenges of military and aerospace applications, or start from the basics with our introductory courses, there's something for everyone. Enroll today and take the next step toward mastering your craft in the electronics industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.

IPC, FED Partner for New Design Conference in Vienna

IPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?

Real Time with... electronica 2024: STARTEAM GLOBAL Meeting Challenges Head-on

STARTEAM GLOBAL CEO Daniel Jacob and CTO Martin Schneider speak with Pete Starkey at electronica 2024 about their global presence in China, Thailand, and Europe, and how additive manufacturing and inkjet printing are keeping this PCB manufacturer at the forefront of technology. They’re excited about sustainability, the future, and competing on the world stage.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.

If You Can Define It Right, You Can Design It Right

Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.

Real Time with... electronica 2024: NCAB—Shaping the Future of Electronics Manufacturing

Michael Larsson, Global Director of Sales at NCAB, shares insights into the company's focus on sourcing production outside of China as well as their commitment to sustainability through innovative materials for recyclable PCBs.

Understanding Depreciation for Electronic Manufacturers

As a PCB design engineer, your focus is on creating innovative, cost-effective designs. However, the financial aspects behind your designs—such as depreciation—play a significant role in the overall business. While depreciation may sound like "accounting speak," understanding it can help you make better decisions for your projects, especially when dealing with equipment, machinery, or even intangible assets like software licenses.

Flex PCB Design Best Practices with Dave Lackey

David Lackey, a flex circuit expert at American Standard Circuits, speaks about the advantages and challenges of designing with flexible and rigid-flex PCBs. He also discusses how consulting before the design phase can save time and costs by avoiding manufacturing issues and highlights the reliability and packaging benefits of flex technology, especially for compact designs in sectors like aerospace.

Accurate Circuit Engineering on Passion and Pushing the Envelope

In this interview at PCB Carolina in November, James Hofer, general manager of Accurate Circuit Engineering (ACE), shares insights into the company’s innovative approach to component embedding and highlights the passion and dedication driving his team’s commitment to quality and innovation in PCB manufacturing. James is still having fun as they push boundaries and do some pretty cool things in the process.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If you’re in the U.S. today, odds are you’re at home enjoying the aftermath of a Thanksgiving holiday meal. Let me just say that whether you had a Thanksgiving holiday surrounded by family, friends, or both, I hope it was joyous. If you know someone who doesn’t have friends or family with whom to share this time, please reach out and include them. Chronic loneliness can exact a measurable toll on our mental and physical health. Wherever you are on the globe this holiday season, I encourage you to reach out to someone who might be battling loneliness and connect. It will make a difference to them. Not only will it help get you in the mood for your winter holiday of choice, but it’ll be good for your mental health as well.

Happy Thanksgiving From the I-Connect007 Team

As we take time to observe Thanksgiving, the I-Connect007 team wishes to offer our thanks to our readers, advertisers, and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. Thank you all for your support.

From Construction Work to PCB Design in Under a Year 

At the Anaheim Electronics & Manufacturing Show in October, I had the opportunity to talk with some new PCB designers, including Jon Smith of Frontgrade Aethercomm. During the Anaheim show, John Watson, a PCB design instructor at Palomar College, led a panel of his past and present students, including Jon, who shared his story of switching from a construction career to PCB design in a matter of months, courtesy of Watson’s Palomar College design curriculum.

PCB Layout Rules of Thumb for Consideration

Just because a “rule of thumb” is usually based on experience instead of precise facts doesn’t negate its value. For instance, when I told my kids that a good rule of thumb was not to back-talk to their mother, they discovered very quickly how accurate my advice was once they crossed that line. There are a lot of rules of thumb that we rely on daily, including those that apply to PCB design.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!

Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology

Marcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.

Rules of Thumb for PCB Layout

The dictionary defines a “rule of thumb” as “a broadly accurate guide or principle, based on experience or practice rather than theory.” Rules of thumb are often the foundation of a PCB designer’s thought process when tackling a layout. Ultimately, a product spec or design guideline will provide the detailed design guidance, but rules of thumb can help to provide the general guidance that will help to streamline the layout process and avoid design or manufacturing issues.

Meet Polar's New Product Specialist Jess Hollenbaugh 

At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.

Designing for Cost to Manufacture

ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.

Enjoy the Journey: PCB Design Instructor Kris Moyer on His Sustainable Lifestyle

When I contacted IPC design instructor Kris Moyer to discuss his sustainable lifestyle, he responded to my text with a call. "I'm calling you from about 8,000 feet, sitting at the foot of Mammoth Lakes," he told me. “My friends and I are about to get in the pool for the afternoon." Kris can do this because he actually lives full-time in his travel-trailer at this campground. He's now a permanent camper, taking him anywhere the winds blow—and where there's strong internet service—so he can teach his PCB design classes, offer expert interviews, and live off the land.

PCB Carolina’s Formula: Industry Experts and Catered Food

PCB Carolina organizers at the Better Boards design bureau seem to have found the perfect formula: Industry experts plus catered food equals a constantly expanding show. This one-day tabletop show has been growing for two decades, and that trendline continued with this year’s event on November 13. 

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We have quite a mix in this week’s must-reads. The November issue of Design007 Magazine was published, and you don’t want to miss Andy Shaughnessy’s column. This week, we also have a discussion of long-flex PCBs with CEE PCB’s Jerome Larez, and we revisit my forward-looking interview with Dr. Evelyne Parmentier of Dyconex. Jim Will gives us an update on the many things that have transpired in his first five months as executive director at USPAE. Finally, Happy Holden’s next installment of Happy’s Tech Talk looks into the weaknesses of CAD drawings by using a famous Escher print as an example. Happy is definitely one of a kind.

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1

Last month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2

The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.

Rules of Thumb: A Primer

Many industry-wide rules of thumb are based on DFM constraints or formulas, but others are based on tribal knowledge. In this interview, Andy Shaughnessy sits down with our contributors Kris Moyer and Kelly Dack to discuss the role of rules of thumb, when to employ them, and when it’s time to do the math.

The Quest for Perfect Products

Anna-Katrina Shedletsky is a former Apple engineer who formed her own company, Instrumental, to address what she felt were frustrating and costly engineering problems and inefficiencies at Apple. She’s passionate about her quest to build perfect products faster than ever before. In this interview, Anna shares her journey from creating innovative products like the Apple Watch to addressing the complexities of failure analysis in manufacturing. She also discusses an upcoming educational webinar she is hosting with Valentina Ratner, CEO of AllSpice.io, for engineering leaders in the manufacturing space. They look forward to providing “real talk” and value to their engineering colleagues.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.​​​​​​​

Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process

PCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.

One Partial HDI Technique: mSAP 

Chris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in PCB design, fabrication, and assembly. We published some mixed news about the EMS segment, and an article about the supply chain. Are companies holding onto too much inventory? After the recent supply chain snafus, I can certainly understand why they might. We have an article about liquid metal ink, a cool new technology developed by LDQX, formerly known as Averatek. We also have an article about fighting advanced counterfeiting methods, and news about an acquisition by Siemens.

Partial HDI: A Delicate Balance

Partial HDI can be the perfect solution for designers faced with escape routing from tight-pitch BGAs. But there are a variety of material, signal integrity, and DFM trade-offs to understand before you get fully into partial HDI. We asked Stephen Chavez to explain the fundamentals, as well as the details, of this promising process. Are you using partial HDI?

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Just this month, the Fall issue of IPC Community was released, spotlighting the global activities of IPC and its members. SMT007 Magazine covers the scary situation around counterfeit components. Design007 Magazine is not playing tricks with its hard-hitting discussions about “partial HDI.” (If you are asking yourself what that is, you really need to take a look.) Finally, PCB007 Magazine’s alternate metallization issue offers some real treats, including an interview featured this past week with Carmichael Gugliotti of MacDermid Alpha. In you’re in the U.S., here’s to an early Happy Halloween.

Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1

The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.

AEMS: Expanding Del Mar’s Vibe into Anaheim

In the final hours of the Anaheim Electronics & Manufacturing Show (AEMS), I spoke with show managers Doug Bodenstab and Connor Good. Doug, a longtime surfer, is also the founder and manager of the Del Mar Electronics & Manufacturing Show at the Del Mar Fairgrounds. I asked Doug and Connor to discuss how the Anaheim show got started and the impact it’s making on the industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Occasionally, I’ll intentionally select items for this list that follow a theme. Sometimes, as they did this week, themes assert themselves. The component supply chain and sourcing seem to dominate our coverage this week. We’ve got an update from IPC Government Relations, an interview with counterfeiting watchdog ERAI, the 10 global sourcing rules, a course on AI and machine learning in the EMS sector, and warehouse management.

Optimizing mSAP to Produce Flex for Biofluid Sensor Probes

Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.

Back to School With Jonathan Studinka

At the Anaheim Electronics & Manufacturing Show, I spoke with Jonathan Studinka, a student in John Watson’s PCB design class at Palomar College. In this interview, Jonathan shares his experience, highlighting how John’s class has broadened his understanding of PCBs and sparked his interest in mechatronics. Despite having no prior electronics training, Jonathan says he finds the coursework manageable by taking it step by step.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction

Design for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost. 

Fall 2024 Issue of IPC Community Now Available

There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way. Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s roundup is a duke’s mixture of news items and interviews with industry experts from design, fabrication and assembly. There’s a lot going on in electronics now. We’ll be bringing you full coverage of SMTA International the week of Oct. 20-24, so stay tuned.

It’s a Wrap for PCB West 2024

PCB West 2024 wraps up Friday, Oct. 11 at the Santa Clara Convention Center (SCCC) in sunny Santa Clara, California. The SCCC is situated next to the “new” Levi’s Stadium, home to the San Francisco 49ers, and directly adjacent to California’s Great America amusement park—both noteworthy landmarks for natives like me. The technical conference, Oct. 8-11, featured 50 technical presentations by 39 different speakers.

UHDI Fundamentals: ‘UHDI’ Bleeding-edge Entertainment Applications, Part 1

As soon as we cross below the 1-mil (0.001") line width threshold, we need to stop talking in terms of mils and ounces and begin talking in terms of microns. For reference, a 3-mil trace is 75 microns, so a 1-mil trace is 25 microns. In general terms, ultra high density interconnect refers to line and spaces on a printed circuit board that are sub-25 micron. In the context of this article, ultra high-definition interconnect (UHDI) refers to the technology and infrastructure used to transmit and connect ultra high-definition signals, typically 4K, 8K, or even higher resolutions, across devices like displays, cameras, servers, and processors.

Partial HDI: A Complete Solution

We recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.

AEMS: Third Time’s the Charm

You’ve probably heard of the Del Mar Electronics & Manufacturing Show (DMEMS). Since 1995, PCB design and manufacturing technologists have flocked to this seminal event at the Del Mar Fairgrounds near San Diego. Originally a regional show, Del Mar has grown yearly and attracts an outsized group of attendees and exhibitors. So, event founder Doug Bodenstab took his vision northward and launched the Anaheim Electronics & Manufacturing Show (AEMS).   

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Fall presents us with a lot of tradeshow activity, such as the Anaheim Electronics & Manufacturing Show, which kicked off the month in California. Our intrepid managing editor Andy Shaughnessy has been on the scene and I look forward to hearing more about the show from him. Next week, we’ll be at PCB West in the Bay Area, followed by SMTAI in Chicago the following week. For me, it feels like a proper launch into standard Q4 craziness highlighted by the end-of-year sales hustle and frenetic finalization of 2025 budgets. October also brings a stark reminder that the holiday season will soon be upon us. So, let the crazy begin.

Silicon to Systems: Collaboration Between IC and PCB Design Continues

The walls are coming down between the designers of chips and PCBs. Because of the complexity of electronic systems, IC designers and PCB designers are increasingly finding themselves in need of information from technologists upstream and downstream, from silicon through the system level. Stephen Chavez, senior product marketing manager at Siemens, shares his thoughts on this silicon-to-systems approach and what it means for PCB designers, EDA tool providers, and system-level developers as well.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If you know Dave Hoover of TTM, then I am honored to inform you that he has retired from the industry as of this week. But we can keep tabs on him through his weekly online blues radio program “Groovy Hoovy’s Different Shades of Blue Radio and Video Show.” Congratulations on your transition to “civilian” life, Dave.

Silicon to Systems: A Wake-up Call for the Industry

Duane Benson, founder of Positive Edge, has been working with silicon and packaging for longer than some of our newer readers have been alive. We asked him to share his thoughts on silicon to systems, which Duane says is much more than a buzzword—it’s a wake-up call for the industry.

Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4

Direct-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.

Cross-domain Design: The Key to Managing Complex Methodologies

For years, Cadence Design Systems has been developing EDA tools that enable the design of ICs and PCBs. Now, as systems continually become more complex, the lines are blurring between these disciplines, and EDA companies are providing designers of PCBs and ICs the ability to understand what’s happening upstream and downstream. We asked John Park, product management group director for advanced IC packaging at Cadence, to discuss this ongoing convergence of domains, as well as what it all means to designers and design engineers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”

PCB Designers: ‘Level Up’ IC, Packaging Knowledge

Soo Lan Cheah is kind of a unicorn in the industry. She is an IPC instructor based in Malaysia, and she has years of experience designing integrated circuits and printed circuit boards. I knew I had to get her thoughts for this issue on silicon-to-systems. I asked Soo Lan to discuss her cross-discipline background and what silicon-to-systems means to her.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week 

At the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.

From Silicon to Systems

For the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

This week’s Top 5 starts with steps you can take to cultivate a culture of thriving. We also have bullish news from the global semiconductor sector, advice on how to tease out hidden cost drivers during the PCB design cycle, how the Altium-Ansys collaboration will affect design, and Happy Holden’s version of Occam’s Razor—three simple tools to keep your wet processes in line.

Impact of the Altium-Ansys Partnership on PCB Design

There’s a saying in electronics hardware design: “There are two types of electronics designers: those who have signal integrity problems and those who will.” This adage emphasizes the inevitability of encountering and the need to address signal integrity (SI) and power integrity (PI) issues.
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