-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Steven Bowles: Taking a Stand
April 7, 2023 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes
Steven Bowles, an associate fellow at Lockheed Martin Space, talks about his journey as a leader in IPC, beginning with the unexpected opportunity that launched his leadership career across a range of professional committees. True progress, Steven says, requires input from a diverse set of perspectives alongside the passion that drives our industry forward.
Steven, congratulations on receiving the IPC President’s Award. As you know, this award is about leadership, so why do you feel it’s important to be a leader at IPC?
It’s important to lead within IPC for a couple of reasons. One of the primary reasons that I enjoy leadership within the standards development committees is to ensure that the standards we release are keeping up with modern technology and that they benefit both user and supplier. It’s a really good idea for us to lead within these groups, to usher in the next generation of IPC participants—the ones who will be writing our technical standards and developing requirements for our industry going forward.
How do you get into this? Did you raise your hand? [laughs]
I kind of got into leadership by accident. About 15 years ago, I was still relatively early in my career, and I joined committees just to learn. I joined IPC T-50, which is terms and definitions, and IPC-6012, which is the performance specification for rigid printed boards. I really liked the T-50 committee because we were determining and defining industry terms that supported electronics. We had two very good committee chairs. When one committee member, Mike Green from Lockheed, announced he was retiring and stepping down, some individuals on the committee commented that it would be good to have some younger leadership. I spoke up and said that I was probably the youngest person in the group and that I would do it. So, I co-led that group with Vicka Hammill of Honeywell for about eight years. From there, it just flourished. I enjoyed leading that group, and subsequently joined several other committees supporting different documents where I started taking on some leadership roles. I’m now chairing six different groups and at least one general committee.
When Vicka retired from Honeywell, she stepped down from leadership of IPC T-50 and we brought on my Emerging Engineer mentee, Aaron Kennedy of Summit, as my vice chair. Now I have stepped down as chair of IPC T-50 this past year and I recommended my internal-to-Lockheed mentee, David Caputa, to be my replacement. Both individuals were actively supporting the group prior to that. It’s pretty cool to see two people who I’m currently mentoring are now holding leadership roles in IPC T-50. I was named Chair Emeritus of that group, so I’m still helping to guide them.
To read this entire conversation, which appeared in the 2023 edition of Show & Tell Magazine, click here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Meet Polar's New Product Specialist Jess Hollenbaugh
11/21/2024 | Andy Shaughnessy, I-Connect007At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.