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DuPont Interconnect Solutions Advances Toward Sustainability Goal
April 24, 2023 | DuPontEstimated reading time: 1 minute

As part of DuPont’s Electronics & Industrial business, Interconnect Solutions (ICS)—a leading total solutions and systems design partner addressing signal integrity and power transmission challenges—is proud to announce another milestone in sustainability, by adopting solar energy in the Laminates manufacturing site in Taiwan. This accomplishment represents the business’ unwavering commitment to environmental stewardship and dedication to taking care of its people and the planet.
In 2021, ICS set a sustainability goal of reaching carbon-neutral operations for the global business segment by 2030. Before the end of 2021, ICS announced that it had already achieved 95 percent of global operations powered by renewable electricity. Its ambitious sustainability goals are focused in three areas: innovating safer by design, enabling a circular economy, and acting on climate change.
In less than two years, ICS has made significant strides in its environmental commitment, including this major milestone at the one of its manufacturing sites in Taiwan, Hsinchu Site 1. This site recently installed more than 1000 solar panels and attained its renewable energy and climate stewardship goals. By adopting solar energy, the site now generates approximately 3.2 percent of its energy capacity sustainably, while reducing CO2 emissions by about 310 tons per year. This milestone is roughly equivalent to planting 11 soccer fields with trees. The site continues to take action to save water and power while reducing copper consumption and raw materials packaging wastes from its daily operation.
“As a responsible and forward-thinking organization, sustainability has been a focal point for our business,” said Thean Ming Tan, Global Business Director, Laminates, ICS. “By joining Apple’s Supplier Clean Energy Program in 2022, DuPont has committed to using 100 percent renewable electricity in the manufacture of all our products for Apple. We also partner with our customers and suppliers to help them achieve their sustainability goals and reduce environmental impacts along the electronics industry value chain.”
He noted that with the evolution of consumer electronics becoming smaller, thinner, and more multifunctional, the need for advanced interconnects, such as flexible printed circuit materials and low-loss materials, will continue to grow. DuPont’s low-loss total solutions are designed for higher frequency and higher speed applications for 5G connectivity. DuPont™ Pyralux® Flexible Copper Clad Laminates (FCCLs) manufactured in ICS Hsinchu Site 1, are designed to be thinner and lighter, which enables design flexibility while maintaining excellent signal integrity.
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09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
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Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.