Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
StenTech’s Greg Starrett to Present Stencil Technology & Guidelines at the SMTA Long Island Meeting
May 12, 2023 | StenTechEstimated reading time: 1 minute
StenTech Inc., the leading multinational SMT Printing Solutions company, is pleased to announce that Greg Starrett, Director of Sales, will present at the Long Island Chapter In-Person Technical Meeting on Wednesday, May 31, 2023. The event will be held at Zebra Technologies and will cover the topic of "Fine Feature Paste Printing, Stencil Design and Solder Technology."
As consumers demand more functionality in increasingly compact devices, the process window for PCB assembly has become narrower due to the miniaturization of component patterns. The presentations will explore how printing machine technology, stencil manufacturers, and solder paste manufacturers have adapted to meet this challenge.
Attendees will learn about the latest advancements in printing machine technology, including new print head technologies and vision systems developed for greater precision. Additionally, solder paste manufacturers have designed materials to provide stable transfer efficiencies, improved wetting, and low voiding properties. They continue to develop smaller particle size solder paste and improved flux chemistries for smaller aperture printing.
Mr. Starrett will discuss how stencil manufacturers have developed new technologies, materials, and techniques such as electroformed stencils and nano coatings to improve print quality and increase the printing process window.
This meeting promises to be informative and valuable to anyone involved in the PCB assembly process, particularly those who are dealing with fine pitch component patterns on PCBs.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.