DuPont, JetCool Announce Collaboration in Thermal Management for High-Power Electronics
June 20, 2023 | PRNewswireEstimated reading time: 1 minute
DuPont and JetCool Technologies Inc. (JetCool) announced a collaboration to increase adoption of advanced liquid cooling technology, enabling thermal management for semiconductors, data centers and other high-performance computing applications. Together, DuPont and JetCool will introduce a new sales channel that brings JetCool's advanced cooling solutions to semiconductor companies in Taiwan and Singapore.
As the demand for faster computing increases, chips are getting more powerful – and hotter. Without high-performance thermal management technology, hot spots on chips can lead to packages overheating and system failure. The challenge is even greater today as the electronics industry deploys artificial intelligence (AI) and edge computing applications with increased processing power requirements. As a result, sustainable liquid cooling is becoming a key part of the data center and high-performance computing infrastructure.
To address these growing needs in thermal management, JetCool has introduced microconvective liquid cooling® technology, reducing both capital and operational expenses, enhancing processing speeds, and sustainably enabling higher computing density. This patented technology uses arrays of fluid jets directed at hot spots on the most powerful devices to optimize performance. DuPont and JetCool will collaborate to increase access of this technology by leveraging DuPont's global team and long-standing customer relationships in the semiconductor materials business.
DuPont's Semiconductor Technologies business is a global manufacturer of materials for semiconductor fabrication, packaging and assembly, with more than 50 years of industry leadership and close relationships with advanced fabricators and integrators. DuPont's strategic proximity to customers positions the company to help advance adoption of liquid cooling in semiconductor packaging applications with complex thermal challenges, supporting broader industry initiatives to drive progress in sustainability.
"We are thrilled to join forces with DuPont in order to make our liquid cooling solutions more accessible to the market," said Bernie Malouin, CEO of JetCool. "Working together allows us to bring advanced thermal management solutions to customers seeking to reduce power consumption and improve performance in their data centers, semiconductor applications and other high-power computing requirements."
Shashi Gupta, global marketing director, Advanced Packaging Technologies, DuPont, said, "JetCool's microconvective liquid cooling® technology is an exciting innovation for energy efficient, on-package thermal management with broad benefits. DuPont's technical experts work closely with customers and advise them on material and process integrations for 2.5/3D package designs. We look forward to sharing JetCool's technology with customers to enable sustainable thermal management solutions."
DuPont customers can contact their account representative for more information.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/10/2024 | Marcy LaRont, PCB007 MagazineSpring is a renewal each year as dormant flora bloom, and baby ducklings and geese are ever present in local bodies of water. Even though it is beginning to get hot, I love this time of year in Arizona, with the sun waking me around 5 a.m. It fills me with an energy that I often lose in the dark winter months. Wherever you find yourself in the world, I hope you are enjoying Spring and that you are filled with energy and enthusiasm for all the great work part of our daily lives in this industry.
Samsung Acquires Sonio; Strengthens Position in Cutting-Edge Medical Devices
05/10/2024 | SamsungSamsung Medison, a global medical equipment company and an affiliate of Samsung Electronics, today announced it has signed an agreement to acquire 100% of the shares of Sonio SAS, a fetal ultrasound AI software company.
Schweizer Receives Future Prize from Ewald Marquardt Private Foundation for p² Pack Embedding Technology
05/10/2024 | Schweizer Electronic AGAs the number of electric vehicles increases, so do the demands on electrical power management in vehicles. To make power generation and engine operation more efficient, Schweizer Electronic AG's p² Pack technology offers a long-term and sustainable solution to better convert and even recover the energy generated.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
TTM Technologies Appoints Wajid Ali to Board of Directors
05/10/2024 | TTM Technologies, Inc.TTM Technologies, Inc. announced that Mr Wajid Ali has been appointed by the unanimous vote of the remaining Directors to serve as a new Class I director on the Board, effective immediately.