-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Summit Interconnect Welcomes Brian Kamradt as New Chief Financial Officer
June 28, 2023 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect today announced the appointment of Brian Kamradt as chief financial officer. Kamradt brings over 20 years of finance, accounting, merger and acquisition, and IT experience to Summit’s leadership team. He will succeed Tom Caldwell, Summit’s initial CFO, who will be retiring after leading the company’s expansion for the past four years.
“Tom played a critical role in Summit’s development, and I wish to sincerely thank him for the significant contributions he’s made to our company,” said Shane Whiteside, CEO of Summit Interconnect. “He is a highly valued and respected colleague.”
Kamradt is a solutions-focused finance leader with proven success in leveraging technology to create scalable service operations. Most recently, as CFO and Head of IT at Jonathan Engineered Solutions, he was directly involved in multiple strategic acquisitions and expanding the use of technology in decision-making. Kamradt also gained significant manufacturing and international finance experience while serving as CFO for Nortek Security, VP of Finance at Curtiss-Wright Corporation, and VP of Finance for Meggitt/Parker.
“Brian clearly has extensive experience managing global financial operations,” said Whiteside. “He also has a track record of implementing transformative business processes that will help accelerate our business initiatives and advance Summit’s industry leadership position. We are pleased to have him on our team.”
Kamradt joins Summit Interconnect at a pivotal time in the printed circuit board (PCB) industry’s evolution. Challenges to supply chains, a tight labor market, and a renewed focus on regional manufacturing has prompted the introduction of government legislation aimed at increasing the production of PCBs in North America.
“I am honored to be joining Summit and am inspired by the company’s vision and purpose,” said Brian Kamradt, CFO at Summit. “Summit’s powerful combination of people, products, and technology is unmatched in the industry. I look forward to working with all the teams to further accelerate growth and create even greater value for our customers and stakeholders.”
Kamradt holds a Master’s in Business Administration from ESADE in Barcelona, Spain, and a Bachelor of Arts in Economics and International Management from Hamline University, St. Paul, Minnesota. He is fluent in English, Spanish, and Catalan.
Suggested Items
Simbe Partners with Plexus to Scale Manufacturing and Meet Global Retail Demand
05/08/2024 | Globe NewswireSimbe, the leading provider of Store Intelligence™ solutions that increase retailer performance through unprecedented visibility and insights, today announced a partnership with Plexus Corp. to bring its best-in-class retail robotics-as-a-service to market quickly and at global scale.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.