- 
                                  
- News
-  Books
                        Featured Books
- pcb007 Magazine
Latest IssuesCurrent Issue  The Legislative Outlook: Helping or Hurting?This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.   Advancing the Advanced Materials DiscussionMoore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.   Inventing the Future With SELTwo years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication. 
- Articles
- Columns
- Links
- Media kit||| MENU
- pcb007 Magazine
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
May 8, 2025 | IPCEstimated reading time: 1 minute
 
                                                                    IPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
In this role, Huprikar is responsible for enhancing alignment, efficiency and support between IPC’s global headquarters and regional teams. Initially reporting into Huprikar are the vice president of international relations and vice presidents of U.S. and Canada, Europe, India and Southeast Asia regions. Collaborating with his team, Huprikar will work to ensure that the needs of each region’s electronics industry are clearly understood and served by IPC.
Huprikar joined IPC in 2012 as vice president of member success. Since then, he has taken roles of increasing responsibility and leadership and most recently served as president of Europe and South Asia operations and led IPC’s globalization initiative to expand the association’s standards, education, and advocacy support to Europe, the United Kingdom, India, and several countries in Southeast Asia including Malaysia, Singapore, Indonesia, and the Philippines.
“Sanjay is a highly experienced business and engineering professional. He has strong cross-cultural leadership skills and vast knowledge of both the key influencers in the global community and the important challenges facing the industry,” said John W. Mitchell, IPC president and CEO. “Through his leadership, regional teams will be better enabled with more resources, greater input and enhanced collaboration for furthering IPC’s mission to build a resilient, sustainable and prosperous global electronics industry.”
Huprikar is based at IPC’s corporate headquarters in Bannockburn, Ill., and can be reached at SanjayHuprikar@ipc.org.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
Building PCBs and Policy in Europe: Group ACB Champions Advocacy, Standards Development, and Technical Leadership
10/30/2025 | Linda Stepanich, Community MagazineHow does a European PCB manufacturer navigate the competitive manufacturing landscape in Europe? By participating in standards development committee meetings, testifying before the European Commission on industry issues, and sponsoring hand-soldering competitions in the region. Group ACB, based in France and Belgium, focuses on high-reliability applications. The 37-year-old company is also active in the Global Electronics Association, giving credit for helping ACB to raise awareness of electronics manufacturing in Europe.
GlobalFoundries Announces Chief Financial Officer Transition
10/28/2025 | GlobalFoundriesGlobalFoundries (GF) announced that, effectively immediately, John Hollister, GF’s Chief Financial Officer, is leaving the company for personal reasons. Sam Franklin, GF’s Senior Vice President of Business Finance, Operations and Investor Relations, will assume the position of Interim Chief Financial Officer while the company conducts a search for a permanent CFO.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
                                         Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production It’s Only Common Sense: Your Biggest Competitor Is Complacency
                                         It’s Only Common Sense: Your Biggest Competitor Is Complacency The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
                                         The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible





 
                     
                 
                    