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Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'

07/16/2025 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
I have read a lot of business books over the years. Some inspire, some educate, and a few do both while also shifting the way we approach leadership and personal growth. Robert Glazer’s "Elevate: Push Beyond Your Limits and Unlock Success in Yourself and Others" falls into the latter category.

Hon Hai Reports New June Sales High Amid AI Boom

07/07/2025 | I-Connect007 Editorial Team
Taiwan-based manufacturing giant Hon Hai Precision Industry Co. reported on July 5 that its sales for June rose 10 percent from the previous year, driven by cloud and networking growth because of the boom in artificial intelligence (AI), the Taipei Times reported.

I-Connect007’s Editor’s Choice: Five Must-Reads for the Week

07/04/2025 | Marcy LaRont, I-Connect007
For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.

Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem

06/24/2025 | PRNewswire
In 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.

Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3

06/25/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Tin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
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